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公开(公告)号：EP1987707B1
公开(公告)日：2009-07-29
申请号：EP07703221.7
申请日：2007-02-02
CPC分类号： H05K3/185 , C12M23/20 , C23C18/2013 , C23C18/2033 , C23C18/204 , H05K1/0284 , H05K3/0014 , H05K2201/0129 , H05K2203/1105 , H05K2203/302 , Y10T428/25
摘要： The invention relates to a method for producing a preferably electrically conductive layer from a moulding by which very narrow interconnects or electrodes can be applied on three-dimensional thin-walled microstructures. For this purpose, the first step involves producing or applying galvanically catalytically effective nuclei on the surface of a shapeable film provided, within those regions on the surface of the film which are provided for the layer. After the film has been shaped to form a moulding, an electrodeposition is effected on the surface of the moulding, whereby the nuclei are combined to form the layer.
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2.发明公开
公开(公告)号：EP1987707A2
公开(公告)日：2008-11-05
申请号：EP07703221.7
申请日：2007-02-02
CPC分类号： H05K3/185 , C12M23/20 , C23C18/2013 , C23C18/2033 , C23C18/204 , H05K1/0284 , H05K3/0014 , H05K2201/0129 , H05K2203/1105 , H05K2203/302 , Y10T428/25
摘要： The invention relates to a method for producing a preferably electrically conductive layer from a moulding by which very narrow interconnects or electrodes can be applied on three-dimensional thin-walled microstructures. For this purpose, the first step involves producing or applying galvanically catalytically effective nuclei on the surface of a shapeable film provided, within those regions on the surface of the film which are provided for the layer. After the film has been shaped to form a moulding, an electrodeposition is effected on the surface of the moulding, whereby the nuclei are combined to form the layer.
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