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1.发明公开PARALLEL BYPASS TYPE FLUID FEEDING DEVICE, AND METHOD AND DEVICE FOR CONTROLLING FLUID VARIABLE TYPE PRESSURE SYSTEM FLOW RATE USED FOR THE DEVICE 审中-公开旁路类型和调节压力系统与可变液体压力流量的方法和设备布置成平行液装置这FLÜSSIGLEITSSPEISEVORRICHTUNGUSED
公开(公告)号：EP1096351A1
公开(公告)日：2001-05-02
申请号：EP00913087.3
申请日：2000-04-03
发明人： OHMI, Tadahiro , KAGATSUME, Satoshi, Tokyo Electron Yamanashi Ltd. , SUGIYAMA, Kazuhiko, Tokyo Electron Yamanashi Ltd. , MINAMI, Yukio, Fujikin Incorporated , NISHINO, Kouji, Fujikin Incorporated , DOHI, Ryousuke, Fujikin Incorporated , YONEHANA, Katsunori, Fujikin Incorporated , IKEDA, Nobukazu, Fujikin Incorporated , YAMAJI, Michio, Fujikin Incorporated , HIROSE, Jun, Tokyo Electron Yamanashi Ltd. , FUKAZAWA, Kazuo, Tokyo Electron Yamanashi Ltd. , KOIZUMI, Hiroshi, Tokyo Electron Yamanashi Ltd. , NAGAOKA, Hideki, Tokyo Electron Yamanashi Ltd. , MORIMOTO, Akihiro, Fujikin Incorporated , UNO, Tomio, Fujikin Incorporated , IDETA, Eiji, Fujikin Incorporated , MATSUMOTO, Atsushi, Fujikin Incorporated , UENOYAMA, Toyomi, Fujikin Incorporated , HIROSE, Takashi, Fujikin Incorporated
IPC分类号： G05D7/06
CPC分类号： G05D7/0658 , G05D7/0664 , Y10S438/935 , Y10T137/0396 , Y10T137/7759 , Y10T137/7761 , Y10T137/86389 , Y10T137/87877 , Y10T137/87917
摘要： A fluid supply apparatus with a plurality of flow lines branching out from one regulator for adjustment of pressure, the flow lines being arranged in parallel, wherein a measure is taken that the operation, that is, opening or closing of one flow passage will have no transient effect on the steady flow of the other flow passages. For this purpose, each flow passage is provided with a time delay-type mass flow controller MFC so that when one closed fluid passage is opened, the mass flow controller on that flow passage reaches a set flow rate Qs in a specific delay time Δt from the starting point.
Also provided are a method and an apparatus for the above in which a plurality of gas types can be controlled in flow rate with high precision by one pressure-type flow control system. To that end, a formula for calculating the flow rate of a gas is theoretically derived that flows with a pressure ratio not higher than the critical pressure ratio. From that formula, the flow factor is defined, so that the formula may be applied to a number of gas types using flow factors.
The method includes calculating the flow rate Qc of a gas passing through an orifice according to formula Qc = KP 1 (K = constant) with a pressure P 1 on an upstream side of the orifice set at twice or more higher than pressure P 2 on a downstream side, wherein the flow factor FF for each kind of gas is calculated as follows: FF = (k/γs){2/(κ + 1)} 1/(κ-1) [κ/{(κ + 1)R}] 1/2 and wherein, if the calculated flow rate of gas type A is Q A , and, when gas type B is allowed to flow through the same orifice under the same pressure on the upstream side and at the same temperature on the upstream side, the flow rate Q B is calculated as follows: Q B = (FF B /FF A )Q A where
ys = concentration of gas in standard state;
κ = ratio of specific heat of gas;
R = constant of gas;
K = proportional constant not depending on the type of gas;
FF A = flow factor of gas type A; and
FF B = flow factor of gas type B.-
公开(公告)号：EP1596107B1
公开(公告)日：2008-07-23
申请号：EP04709325.7
申请日：2004-02-09
发明人： OHMI, Tadahiro , IKEDA, Nobukazu, Fujikin Incorporated , YAMAJI, Michio, Fujikin Incorporated , KITANO, Masafumi, Fujikin Incorporated , MORIMOTO, Akihiro, Fujikin Incorporated
摘要： A diaphragm valve for a vacuum evacuation system applicable to a semiconductor manufacturing system. Corrosion of members due to deposition/adhesion of products produced by thermolysis of gas, clogging due to products, and seat leakage are prevented. This diaphragm valve leads to reduction in the scale of the vacuum evacuation system facility, reduction in cost, and reduction in diameter of piping of the vacuum evacuation system for the purpose of decrease in vacuum evacuation time. Specifically, the diaphragm valve (1) comprises a body (2) having an inlet passage (6), an outlet passage (7), and a valve seat (8) provided between the passages, a diaphragm (3) which is provided to the body (2) and can be separated from the valve seat (8) and brought into contact with the same, and drive means (4) provided to the body (2) and adapted to separate the diaphragm (3) from the valve seat (8) and to bring the diaphragm (3) into contact with the same. The portion (25) of the body (2) and the portion (25) of the diaphragm (3) both coming into contact with a fluid are coated with a synthetic resin coating (5) of predetermined thickness.
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公开(公告)号：EP1596107A1
公开(公告)日：2005-11-16
申请号：EP04709325.7
申请日：2004-02-09
发明人： OHMI, Tadahiro , IKEDA, Nobukazu, Fujikin Incorporated , YAMAJI, Michio, Fujikin Incorporated , KITANO, Masafumi, Fujikin Incorporated , MORIMOTO, Akihiro, Fujikin Incorporated
摘要： With the diaphragm valve in the vacuum exhaustion system applied to the semiconductor manufacturing facilities, it is possible to prevent the corrosion of the valve members caused by the accumulation and adherence of the substances as produced by the thermal decomposition, the clogging caused by the substances as produced, and the seat leakage. Further, it is possible to make the facilities for the vacuum exhaustion system small-sized, and, as a result, to lower the costs. It is also possible to reduce the diameter of the vacuum exhaustion system pipings for shortening the vacuum exhaustion time.
Specifically, the diaphragm valve 1 is provided with a body 2 having a flow-in passage 6, a flow-out passage 7, and a valve seat 8 formed between the passages; a diaphragm 3 installed in the body 2 and permitted to rest on and move away from the valve seat 8; and a driving means 4 installed on the body 2 to allow the diaphragm 3 to rest on and move away from the valve seat 8, wherein synthetic resin films 5 of predetermined thickness are coated on fluid-contacting parts 25 of the afore-mentioned body 2 and diaphragm 3.摘要翻译： 通过将真空排气系统中的隔膜阀应用于半导体制造设备，可以防止由热分解产生的物质的积聚和粘附引起的阀构件的腐蚀，由物质引起的堵塞 产生和座位泄漏。 此外，可以使真空耗尽系统的设施小型化，从而降低成本。 也可以减小真空耗尽系统管道的直径，以缩短真空耗尽时间。 具体地，隔膜阀1设置有形成在通道之间的流入通道6，流出通道7和阀座8的主体2; 隔膜3安装在主体2中并允许静止在阀座8上并远离阀座8; 以及安装在主体2上的驱动装置4，以允许隔膜3搁置并离开阀座8，其中预定厚度的合成树脂膜5涂覆在上述主体2的流体接触部分25上 和隔膜3.
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公开(公告)号：EP1130309B1
公开(公告)日：2006-07-26
申请号：EP00957104.3
申请日：2000-09-11
申请人： FUJIKIN INCORPORATED
发明人： IKEDA, Nobukazu, Fujikin Incorporated , MORIMOTO, Akihiro, Fujikin Incorporated , MINAMI, Yukio, Fujikin Incorporated , HONIDEN, Teruo, Fujikin Incorporated , KAWADA, Kouji, Fujikin Incorporated , KOMEHANA, Katunori, Fujikin Incorporated , HIRAI, Touru, Fujikin Incorporated , YAMAJI, Michio, Fujikin Incorporated
摘要： A dewatering method for gas supply systems which is adapted for effective removal of adsorbed water by ordinary-temperature exhaust processing without using the baking method. The dewatering method for gas supply systems which remove water remaining inside a gas supply system by passing a dewatering gas through the gas supply system, characterized in that the dewatering gas flow pressure is set at values which are above a minimum pressure at which the gas flow becomes a viscous flow but which are below the saturated vapor pressure of water at the dewatering gas flow temperature. The condition under which the dewatering gas becomes a viscous flow is determined by the mean free path of gas molecules becoming smaller than the diameter of the piping for the gas supply system. If the dewatering gas is exhausted at ordinary temperature under such condition, the adsorbed water on the inner surface of the piping or in the valve filter can be effectively removed.
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公开(公告)号：EP1130309A1
公开(公告)日：2001-09-05
申请号：EP00957104.3
申请日：2000-09-11
申请人： Fujikin Incorporated
发明人： IKEDA, Nobukazu, Fujikin Incorporated , MORIMOTO, Akihiro, Fujikin Incorporated , MINAMI, Yukio, Fujikin Incorporated , HONIDEN, Teruo, Fujikin Incorporated , KAWADA, Kouji, Fujikin Incorporated , KOMEHANA, Katunori, Fujikin Incorporated , HIRAI, Touru, Fujikin Incorporated , YAMAJI, Michio, Fujikin Incorporated
摘要： A method of removing moisture efficiently in the gas supply system by evacuation at normal temperature without using the baking method. The method involves flowing a gas to remove moisture in the gas supply system with the flow pressure of the gas to remove moisture set at not lower than a minimum pressure at which the gas flow becomes viscous and not higher than a water saturated vapor pressure at a flow temperature of the gas to remove moisture. The gas to remove moisture achieves a viscous flow when a mean free path of gas molecules is smaller than a diameter of piping of the gas supply system. If the gas for removing moisture is evacuated at normal temperature under such conditions, the adsorbed moisture on an inside surface of the piping and in the valves and filters can be removed effectively.
摘要翻译： 通过在常温下抽空而不使用烘烤方法，在气体供给系统中有效地除去水分的方法。 该方法包括使气体流动以除去气体流量的气体中的水分，以除去在不低于气流变粘稠的最低压力并且不高于 气体的流动温度去除水分。 当气体分子的平均自由程小于气体供应系统的管道直径时，去除水分的气体达到粘性流动。 如果用于除去水分的气体在这样的条件下在常温下抽真空，则能够有效地除去管道内部表面，阀门和过滤器中的吸附水分。
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