公开(公告)号：EP1094134A1

公开(公告)日：2001-04-25

申请号：EP00309054.5

申请日：2000-10-16

申请人： GENERAL ELECTRIC COMPANY

发明人： Wei, Bin ,  Macdonald, Leo Spitz ,  Lipkin, Don Mark

IPC分类号： C25F5/00

CPC分类号： C25F5/00

摘要： An electrochemical stripping process is described that strips at least one metallic coating from a substrate. Due to the electrochemical selectivity of the disclosed process, the parent alloy is minimally affected by the electrochemical stripping process. The process comprises providing an electrolyte (3); disposing the coated articles (6) and at least one electrode (4, 5) in the electrolyte; applying a current between the electrode and the coated articles, and removing the at least one coating from the coated articles without modifying the parent alloy. The system for the electrochemical stripping process comprises an electrolyte (3); a direct current source (10); and plurality of electrodes (4, 5) from which a direct current may be directed to the article being stripped. The direct current source is capable of being connected to the coated articles and the plurality of electrodes. The system permits removal of the at least one coating from the parent alloy.

摘要翻译： 一种电化学剥离过程从底物描述做带至少一个金属涂层。 由于盘处理游离缺失的电化学选择性，母材合金几乎不受电化学剥离过程的影响。 该方法包括电解质的提供（3）; 布置所述涂覆的制品（6）和至少一个电极（4，5）中的电解质; 施加电流的电极和涂覆制品之间，并且无需修改母材合金中除去从所述涂覆的制品上的至少一个涂层。 对于电解质（3）的电化学剥离方法包括系统; 直流电源（10）; 和电极的多元性（4，5），从直流可以在制品被剥离引导。 直流源是能够被连接到所述的涂覆制品和电极的多个。 该系统允许去除从母材合金的所述至少一个涂层。