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    Means for supporting and sealing the lead structure of a lamp and method for making such lamp
    2.
    发明公开
    Means for supporting and sealing the lead structure of a lamp and method for making such lamp 失效
    用于生产和制备它们的灯电源和过程的密封的装置。

    公开(公告)号：EP0597679A1

    公开(公告)日：1994-05-18

    申请号：EP93308956.7

    申请日：1993-11-09

    申请人： GENERAL ELECTRIC COMPANY

    发明人： Balaschak, Edward James ,  Scott, Curtis Edward ,  Sakoske, George E.

    IPC分类号： H01J61/36 ,  H01K1/38

    CPC分类号： H01J61/363 ,  H01K1/38

    摘要： This lamp comprises (1) an envelope of vitreous light-transmitting material enclosing an internal space where light is generated and (ii) conductive lead structure projecting into said internal space. Surrounding and sealed to said lead structure is a body of vitreous material formed of particles of vitreous material pressed together and sintered. This body extends through an opening in the envelope that communicates with said internal space. A hermetic seal is provided between said envelope and said body in the interface region between said envelope and said body.
    A method of manufacture for the lamp involves making up, separate from the envelope, a subassembly comprising said lead structure and said vitreous body that surrounds it. In one form of this method, particles of vitreous material are pressed into a mold cavity that surrounds the lead structure, thus forming a compact surrounding the lead structure. This compact is sintered in an inert atmosphere, thereby forming the subassembly. Thereafter, the subassembly is placed in the opening in the envelope, and the hermetic seal is made between said envelope and said vitreous body in the interface region between said envelope and said vitreous body.

    摘要翻译： 该灯包括：（1），其中产生光内部空间，和（ii）导电引线结构伸入所述内部空间玻璃体透光材料包围的包络。 周围并密封以导致所述结构形成压在一起并烧结玻璃材料的粒子的玻璃质材料制成的主体。 该机构通过延伸到信封开口确实连通与所述内部空间。 甲气密密封在所述包络和所述身体之间的界面区域，在所述包络和所述主体之间。 制造用于灯的方法包括构成，从信封分开，一个子组件包括所述引线结构和所述玻璃体做围绕它。 在该方法的一种形式中，玻璃质材料的颗粒被压入模具腔体没有包围的引线结构，由此形成包围着引线结构紧凑。 这种紧凑的烧结在惰性气氛，从而形成子组件。 那里之后，子组件被放置在信封中的开口，并且所述气密密封在所述封套之间的界面区域，在所述包络和所述玻璃体之间进行和上述玻璃体。