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    Structures for attaching or sealing a space between components having different coefficients or rates of thermal expansion
    1.
    发明公开
    Structures for attaching or sealing a space between components having different coefficients or rates of thermal expansion 审中-公开
    紧固或具有不同的热膨胀系数之间的部件的密封装置

    公开(公告)号：EP1426561A2

    公开(公告)日：2004-06-09

    申请号：EP03254494.2

    申请日：2003-07-18

    申请人： GENERAL ELECTRIC COMPANY

    发明人： Corman, Gregory Scot ,  Dean, Anthony John ,  Tognarelli, Leonardo ,  Pecchioli, Mario

    IPC分类号： F01D11/00

    CPC分类号： F23R3/007 ,  F01D11/001 ,  F01D11/02 ,  F23M2900/05005 ,  Y02T50/67 ,  Y02T50/672

    摘要： A structure for attaching together or sealing a space between a first component (50) and a second component (100) that have different rates or amounts of dimensional change upon being exposed to temperatures other than ambient temperature comprises a first attachment structure (208) associated with the first component (50) that slidably engages a second attachment structure (210) associated with the second component (100), thereby allowing for an independent floating movement of the second component (100) relative to the first component (50). The structure can comprise split rings, laminar rings, or multiple split rings.

    摘要翻译： 一种用于附接到一起或密封的第一组分（50）和第二部件（100）之间的空间结构在暴露于包括第一附接结构（208）相关联的比环境温度的其它温度thathave不同的速率或尺寸变化的量 与所述第一部件（50）那样可滑动地接合与所述第二部件（100）相关联的第二附接结构（210），从而允许在所述第二部件（100）相对于所述第一部件（50）的独立浮动运动。 该结构可包括开口环，层状环，或多个开口环。