Method for evaluating burnishing element condition
    5.
    发明公开
    Method for evaluating burnishing element condition 有权
    维尔法罕zur Zustandsbewertung eines Festwalzelements

    公开(公告)号:EP1938925A1

    公开(公告)日:2008-07-02

    申请号:EP07123702.8

    申请日:2007-12-19

    IPC分类号: B24B39/00 C21D7/08 C22F1/00

    CPC分类号: B24B39/00 B24B39/003

    摘要: A method of evaluating the condition of a rolling burnishing element (14) includes moving a burnishing element (14) having an unknown condition against a surface in a preselected test pattern (T1); while moving the burnishing element (14), recording at least one test force profile (30) representative of a force acting on the burnishing element (14) in at least one dimension; and comparing the at least one test force profile (30) to at least one baseline force profile (28) to determine a deviation of the condition of the second burnishing element (14) from a baseline condition.

    摘要翻译: 评估轧制抛光元件(14)的状态的方法包括以预选的测试图案(T1)将具有未知状态的抛光元件(14)移动到表面上; 在移动抛光元件(14)的同时,在至少一个维度上记录表示作用在抛光元件(14)上的力的至少一个测试力分布(30); 以及将所述至少一个测试力分布(30)与至少一个基准力分布(28)进行比较,以确定所述第二抛光元件(14)的条件与基线条件的偏差。

    Method and apparatus for process control of burnishing
    7.
    发明公开
    Method and apparatus for process control of burnishing 有权
    Verfahren zur Steuerung einesPrägepolierverfahrens

    公开(公告)号:EP1721703A1

    公开(公告)日:2006-11-15

    申请号:EP06252474.9

    申请日:2006-05-11

    IPC分类号: B24B39/00 B23Q3/06

    CPC分类号: B24B39/00 Y10T29/47

    摘要: An apparatus for process control of a burnishing process including a body having a first end (14) and a second end (16), at least one process control coupon (100), and structure for attaching the process control coupon (100) to the body. At least one edge (101, 102, 103, 104) of the process control coupon (100) is clamped along the entire length thereof during burnishing. A method of process control for burnishing of components comprising selecting at least one process control coupon (100), selecting an apparatus (10) for holding the process control coupon(s) (100), attaching the process control coupon(s) (100) to the apparatus (10), selecting a region (301) on the surface (121, 122) of the process control coupon(s) (100) for burnishing, burnishing a patch (303) on the selected region (301) using a burnishing process, and, measuring at least one physical parameter at a selected location of the process control coupon(s) (100) after burnishing.

    摘要翻译: 一种用于抛光工艺的过程控制的设备,包括具有第一端(14)和第二端(16)的主体,至少一个过程控制优惠券(100)和用于将过程控制优惠券(100)附接到 身体。 在抛光期间,过程控制券(100)的至少一个边缘(101,102,103,104)沿其整个长度被夹紧。 一种用于抛光组件的过程控制的方法,包括选择至少一个过程控制优惠券(100),选择用于保持过程控制优惠券(100)的设备(10),附加过程控制优惠券(100个) )选择在所述过程控制优惠券(100)的表面(121,122)上的区域(301),用于抛光,在所选择的区域(301)上抛光贴片(303),所述贴片(303)使用 抛光过程,以及在抛光之后测量过程控制试剂(100)的选定位置处的至少一个物理参数。