SOLID STATE IMAGING DEVICE
    1.
    发明公开
    SOLID STATE IMAGING DEVICE 有权
    固态成像装置

    公开(公告)号:EP1874044A1

    公开(公告)日:2008-01-02

    申请号:EP06731667.9

    申请日:2006-04-12

    IPC分类号: H04N5/335 H01L27/146

    摘要: A solid-state imaging device 1 is provided with (1) a photodetecting section 11 in which MxN of pixels are two-dimensionally arranged in M rows and N columns, and a pixel P m,n at the m-th row and the n-th column includes a photodiode PD1 m , n , (2) a row selecting section 20 that selects one or more rows, out of M rows of the photodetecting section 11, instructs each pixel in the selected rows to accumulate an electric charge generated in the photodiode PD1 m,n in response to the incidence of light, and instructs to output data corresponding to the amount of accumulated electric charge of each pixel by each row of the photodetecting section 11, and (3) a first signal processing section 30 that inputs data of each pixel, outputted by each row of the photodetecting section 11 by an instruction from the row selecting section 20, and outputs the data by each pixel.

    摘要翻译: 固态成像装置1设置有(1)光电检测部11,其中M×N个像素以二维方式布置在M行和N列中,并且第m行和第n列中的像素P m, (2)从光检测部11的M列中选择1行以上的行的行选择部20指示选择行中的各像素累积在光电二极管PD1m,n中产生的电荷 (3)第一信号处理部30,其根据光的入射量PD1m,n,指示与受光部11的各行的各像素的蓄积电荷量对应的数据,(3)第一信号处理部30, 通过来自行选择部20的指示,由光检测部11的各行输出的各像素,按照各像素输出数据。

    SOLID-STATE IMAGE PICKUP DEVICE
    2.
    发明授权

    公开(公告)号:EP1845713B1

    公开(公告)日:2017-11-29

    申请号:EP06712921.3

    申请日:2006-02-02

    IPC分类号: H04N5/376 H04N3/14 H04N5/345

    CPC分类号: H04N5/3765 H04N5/3454

    摘要: There is provided a solid-state imaging device in which images can be read at high speed. Since an n-th processing circuit (e.g. PU1) can be connected to n-th pixel columns (N1) in respective imaging blocks B1, B2, and B3 via switches Q (1), Q (4), and Q (7), signals from the adjacent pixel columns (N2) are to be processed separately by another processing circuit (PU2) even when a partial readout area R may be small. In addition, an image data arithmetic section 10 specifies the partial readout area R restrictively, which allows for higher speed imaging.

    X-RAY IMAGE ACQUISITION DEVICE AND X-RAY IMAGE ACQUISITION SYSTEM

    公开(公告)号:EP4358505A1

    公开(公告)日:2024-04-24

    申请号:EP22841749.9

    申请日:2022-03-31

    IPC分类号: H04N5/32 H04N25/76 H04N25/74

    CPC分类号: H04N5/32

    摘要: An X-ray image acquisition device includes a pixel unit having M pixel arrays each including N pixel portions (N and M are integers of 2 or more), M circuit units, and a control unit. Each circuit unit includes T (T is an integer of N or more) adding sections that sequentially add electrical signals corresponding to output signals from the N pixel portions and a switch section for switching connection states between the N pixel portions and the T adding sections. The control unit switches the connection states in synchronization with the transportation of an object along a first direction so that the electrical signals corresponding to the output signals output from the pixel portions by detecting X-rays transmitted through the same region of the object are added by the same adding sections.

    SOLID STATE IMAGING DEVICE
    4.
    发明授权
    SOLID STATE IMAGING DEVICE 有权
    SEMICONDUCTORS成像元件

    公开(公告)号:EP1874044B1

    公开(公告)日:2016-10-12

    申请号:EP06731667.9

    申请日:2006-04-12

    IPC分类号: H04N5/335 H01L27/146

    摘要: A solid-state imaging device 1 is provided with (1) a photodetecting section 11 in which MxN of pixels are two-dimensionally arranged in M rows and N columns, and a pixel P m,n at the m-th row and the n-th column includes a photodiode PD1 m , n , (2) a row selecting section 20 that selects one or more rows, out of M rows of the photodetecting section 11, instructs each pixel in the selected rows to accumulate an electric charge generated in the photodiode PD1 m,n in response to the incidence of light, and instructs to output data corresponding to the amount of accumulated electric charge of each pixel by each row of the photodetecting section 11, and (3) a first signal processing section 30 that inputs data of each pixel, outputted by each row of the photodetecting section 11 by an instruction from the row selecting section 20, and outputs the data by each pixel.

    SOLID-STATE IMAGING DEVICE AND IMAGING METHOD
    5.
    发明授权
    SOLID-STATE IMAGING DEVICE AND IMAGING METHOD 有权
    固态图像传感器系统和成像方法的

    公开(公告)号:EP2099214B1

    公开(公告)日:2015-01-07

    申请号:EP07832184.1

    申请日:2007-11-20

    IPC分类号: H04N5/32 H04N5/335

    CPC分类号: H04N5/32 H04N5/357 H04N5/378

    摘要: A determination unit 70 determines whether there is incident light, based on an output value from an integrating circuit 62, and generates a determinated signal indicating a determinated result. A control unit 80 controls charge accumulating portions of an imaging light-receiving unit 10 whether or not to start accumulation of an electric charge, based on the determinated signal, and changes a charge accumulation capacitance value of the integrating circuit 62 of an output unit 60. Specifically, the control unit 80 varies the capacitance value for accumulation of an electric charge generated in a trigger light-receiving unit 20, depending upon the detection result on the presence/absence of incident light, to switch the sensitivity of the integrating circuit 62 to the trigger PD, thereby enabling optimal utilization of the trigger PD.

    SOLID STATE IMAGING DEVICE
    6.
    发明公开
    SOLID STATE IMAGING DEVICE 审中-公开
    HALBLEITER-BILDGEBUNGSBAUELEMENT

    公开(公告)号:EP1980208A1

    公开(公告)日:2008-10-15

    申请号:EP07707703.0

    申请日:2007-01-30

    摘要: A solid-state image pickup device 1 includes an imaging photodetecting section 10, a triggering photodetecting section 20, a row selecting section 30, a column selecting section 40, a voltage holding section 50, an output section 60, and a controlling section 70. The imaging photodetecting section 10 is for taking an image of incident light, and includes pixel sections P 1,1 to P M,N arrayed two dimensionally in M rows and N columns. The triggering photodetecting section 20 is for detecting an incidence of light, and includes a triggering photodiode that generates electric charge of an amount according to an incident light intensity. The output section 60 outputs pixel data of a value according to the amount of electric charge generated by a photodiode of any pixel section P m,n of the pixel sections P 1,1 to P M,N included in the imaging photodetecting section 10 and triggering data of a value according to the amount of electric charge generated by the triggering photodiode included in the triggering photodetecting section 20 to a common output signal line Lout.

    摘要翻译: 固体摄像装置1包括摄像受光部10,触发用光检测部20,行选择部30,列选择部40,电压保持部50,输出部60以及控制部70。 成像光检测部分10用于拍摄入射光的图像,并且包括以M行和N列二维排列的像素部分P 1,1至PM,N。 触发光检测部分20用于检测光的入射,并且包括产生根据入射光强度的量的电荷的触发光电二极管。 输出部分60根据由成像光电检测部分10中包括的像素部分P 1,1至PM,N的任何像素部分P m,n的光电二极管产生的电荷量输出值的像素数据,并触发 根据由触发光电检测部20中包含的触发光电二极管所产生的电荷量与公共输出信号线Lout的值的数据。

    OPTICAL SENSOR
    7.
    发明授权

    公开(公告)号:EP1607715B1

    公开(公告)日:2018-03-28

    申请号:EP04709757.1

    申请日:2004-02-10

    摘要: A signal processing circuit 20 has switches 21, a shift register 22, and an integrating circuit 23, and outputs voltages Vout indicating luminance profiles in a second direction and in a first direction of light incident to a photosensitive region 10. The switches 21 are provided corresponding to groups of photosensitive portions on one side electrically connected among a plurality of pixels arrayed in the first direction and corresponding to groups of photosensitive portions on another side electrically connected among a plurality of pixels arrayed in the second direction. The shift register 22 is an element for sequentially reading electric currents from the groups of photosensitive portions on one side in the second direction and for sequentially reading electric currents from the groups of photosensitive portions on another side in the first direction. The integrating circuit 23 sequentially imports the electric currents from the groups of photosensitive portions on one side and the groups of photosensitive portions on another side sequentially read by the shift register 22, and converts the electric currents into voltages.

    SOLID-STATE IMAGING DEVICE AND IMAGING METHOD
    8.
    发明公开
    SOLID-STATE IMAGING DEVICE AND IMAGING METHOD 有权
    FESTKÖRPER-BILDGEBERANORDNUNG UND BIGDGEBUNGSVERFAHREN

    公开(公告)号:EP2099214A1

    公开(公告)日:2009-09-09

    申请号:EP07832184.1

    申请日:2007-11-20

    IPC分类号: H04N5/32 H04N5/335

    CPC分类号: H04N5/32 H04N5/357 H04N5/378

    摘要: A determination unit 70 determines whether there is incident light, based on an output value from an integrating circuit 62, and generates a determinated signal indicating a determinated result. A control unit 80 controls charge accumulating portions of an imaging light-receiving unit 10 whether or not to start accumulation of an electric charge, based on the determinated signal, and changes a charge accumulation capacitance value of the integrating circuit 62 of an output unit 60. Specifically, the control unit 80 varies the capacitance value for accumulation of an electric charge generated in a trigger light-receiving unit 20, depending upon the detection result on the presence/absence of incident light, to switch the sensitivity of the integrating circuit 62 to the trigger PD, thereby enabling optimal utilization of the trigger PD.

    摘要翻译: 确定单元70基于来自积分电路62的输出值来确定是否存在入射光,并且产生指示确定结果的确定信号。 控制单元80基于确定的信号来控制成像光接收单元10的电荷累积部分,并且基于确定的信号开始累积电荷,并且改变输出单元60的积分电路62的电荷累积电容值 具体地,控制单元80根据对入射光的存在/不存在的检测结果,改变在触发光接收单元20中产生的电荷的累积的电容值,以切换积分电路62的灵敏度 到触发器PD,从而实现触发器PD的最佳利用。

    SOLID-STATE IMAGING DEVICE
    9.
    发明公开
    SOLID-STATE IMAGING DEVICE 有权
    固态成像装置

    公开(公告)号:EP2012529A1

    公开(公告)日:2009-01-07

    申请号:EP07742173.3

    申请日:2007-04-23

    IPC分类号: H04N5/335 H01L27/146

    摘要: The solid-state image pickup device 1 includes an imaging region 10, a triggering photosensitive region 20, a row selecting section 30, a column selecting section 40, a voltage holding section 50, an output section 60, and a controlling section 70. The solid-state image pickup device 1 reads out triggering data by the triggering photosensitive region 20, the integrating circuit 62, and the triggering A/D converting circuit 64 before light incidence, and senses the light incidence on the basis of the triggering data. After the solid-state image pickup device senses the light incidence, the solid-state image pickup device reads out pixel data by the imaging region 10, the voltage holding section 50, a differential operating circuit 61, and an imaging A/D converting circuit 63.

    摘要翻译: 固态图像拾取装置1包括成像区域10,触发光敏区域20,行选择部分30,列选择部分40,电压保持部分50,输出部分60和控制部分70。 固态图像拾取装置1在光入射之前通过触发光敏区域20,积分电路62和触发A / D转换电路64读取触发数据,并且基于触发数据感测光入射。 在固态图像拾取装置感测到光入射之后,固态图像拾取装置通过成像区域10,电压保持部分50,差分操作电路61和成像A / D转换电路读出像素数据 63。

    SOLID-STATE IMAGE PICKUP DEVICE
    10.
    发明公开
    SOLID-STATE IMAGE PICKUP DEVICE 有权
    固态图像拾取设备

    公开(公告)号:EP1845713A1

    公开(公告)日:2007-10-17

    申请号:EP06712921.3

    申请日:2006-02-02

    IPC分类号: H04N5/335

    CPC分类号: H04N5/3765 H04N5/3454

    摘要: There is provided a solid-state imaging device in which images can be read at high speed. Since an n-th processing circuit (e.g. PU1) can be connected to n-th pixel columns (N1) in respective imaging blocks B1, B2, and B3 via switches Q (1), Q (4), and Q (7), signals from the adjacent pixel columns (N2) are to be processed separately by another processing circuit (PU2) even when a partial readout area R may be small. In addition, an image data arithmetic section 10 specifies the partial readout area R restrictively, which allows for higher speed imaging.

    摘要翻译: 提供了一种可以高速读取图像的固态成像装置。 由于第n个处理电路(例如PU1)可以经由开关Q(1),Q(4)和Q(7)连接到各个成像块B1,B2和B3中的第n个像素列(N1) 即使当部分读出区域R可能较小时,来自相邻像素列(N2)的信号也将被另一处理电路(PU2)单独处理。 另外,图像数据运算部分10限制性地指定部分读出区域R,其允许更高速度的成像。