公开(公告)号：EP3934525A1

公开(公告)日：2022-01-12

申请号：EP20712410.8

申请日：2020-03-06

Applicant: NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO ,  Henkel AG & Co. KGaA

Inventor： ZALAR, Peter ,  SMITS, Edsger Constant Pieter ,  VAN DER MEULEN, Inge ,  GILLISSEN, Stijn ,  NEGELE, Carla ,  GOETHEL, Frank ,  ROSCHEK, Tobias ,  BESLER, Alissa

IPC: A61B5/0408 ,  A61B5/00

公开(公告)号：EP4323463A1

公开(公告)日：2024-02-21

申请号：EP22712594.5

申请日：2022-03-15

Applicant: Henkel AG & Co. KGaA

Inventor： ROSCHEK, Tobias ,  NEGELE, Carla ,  KOTTHOFF, Sebastian ,  GOETHEL, Frank

IPC: C09J5/00 ,  C09J9/02

公开(公告)号：EP3935119A1

公开(公告)日：2022-01-12

申请号：EP20706353.8

申请日：2020-03-02

Applicant: Henkel AG & Co. KGaA

Inventor： NEGELE, Carla ,  VAN DER MEULEN, Inge ,  GILLISSEN, Stijn ,  ROSCHEK, Tobias ,  GOETHEL, Frank ,  BESLER, Alissa ,  SCHNEIDER, Anja

IPC: C09J133/06 ,  A61B5/0408 ,  C08K5/17 ,  C08K5/3442

公开(公告)号：EP3934524A1

公开(公告)日：2022-01-12

申请号：EP20706530.1

申请日：2020-03-02

Applicant: Henkel AG & Co. KGaA

Inventor： NEGELE, Carla ,  VAN DER MEULEN, Inge ,  GILLISSEN, Stijn ,  ROSCHEK, Tobias ,  GOETHEL, Frank ,  BESLER, Alissa

IPC: A61B5/0408 ,  A61B5/0402 ,  A61B5/0476 ,  A61B5/0488 ,  A61B5/053 ,  H01M4/04

公开(公告)号：EP3705035A1

公开(公告)日：2020-09-09

申请号：EP19161223.3

申请日：2019-03-07

Applicant: Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO ,  Henkel AG & Co. KGaA

Inventor： ZALAR, Peter ,  SMITS, Edsger Constant Pieter ,  VAN DER MEULEN, Inge ,  GILLISSEN, Stijn ,  NEGELE, Carla ,  GOETHEL, Frank ,  ROSCHEK, Tobias ,  BESLER, Alissa

IPC: A61B5/0408 ,  A61B5/00

Abstract: A method of manufacturing a skin-compatible electrode (100) comprises printing a circuit pattern (P1) onto a flexible substrate (200) to form an electrically conductive pattern including an electrode pad area (301). A layer of an adhesive composition (401p) is printed in a second pattern (P2) onto the electrode pad area (301) to form an adhesive interface layer (401). The adhesive interface layer (401) is a dry film formed from the adhesive composition (401p) comprising an ionically conductive pressure sensitive adhesive composition comprising a resin (R), an ionic liquid (I), and optionally electrically conductive particles (P). A layer thickness and material of the flexible substrate, the conductive pattern, and the conductive adhesive interface have relatively low stiffness in plane of the flexible substrate (200).