公开(公告)号：EP3172608A1

公开(公告)日：2017-05-31

申请号：EP15824258.6

申请日：2015-07-22

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： RIEL, Peter ,  ROSSI, Markus ,  CALERO, Daniel Pérez ,  GLOOR, Matthias ,  DORON, Moshe ,  BAKIN, Dmitry ,  BOUCHILLOUX, Philippe

IPC: G02B7/02 ,  H01L27/144

CPC classification number: G03B21/142 ,  G02B7/003 ,  G02B7/02 ,  G03B21/2033 ,  H01L27/14618 ,  H01L33/483 ,  H01L33/58 ,  H01L2933/0033 ,  H01L2933/0058

Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.

Abstract translation: 本公开内容描述了各种模块，其可以为诸如光发射器或光检测器之类的光电子器件提供超精确和稳定的封装。 模块包括垂直对准特征，根据需要，可以在模块制造期间加工垂直对准特征，以在光电子器件与设置在光电子器件上的光学元件或光学组件之间建立精确的距离。