Light emitting diode print head assembly
    1.
    发明公开
    Light emitting diode print head assembly 失效
    发光二极管打印头组件

    公开(公告)号:EP0364077A3

    公开(公告)日:1990-09-19

    申请号:EP89307837.8

    申请日:1989-08-02

    CPC分类号: B41J2/45

    摘要: This technique for assembling a print head for an LED printer has LED dice (16) first assembled into precisely known locations on mounting tiles (13). A portion (19) of the front face of each tile (13) is left exposed beyond anything mounted on the tile (13). The tiles (13) are then assembled with these exposed areas (19) on a planar reference (32) on an assembly fixture (31). Reference surfaces (34,36) built into the fixture (31) align the edges of the tiles (13), and hence the LED dice (16). Finally a mother plate (10) is adhesively bonded onto the backs of the tiles (13). The adhesive accommodates thickness variations in the mounting tiles (13), and lack of flatness in the back surfaces of the tiles (13) and the front face of the mother plate (10). Reference tiles (41) coplanar with the reference plane formed by the front faces of the mounting tiles (13) provide a z axis reference.

    Light emitting diode print head assembly
    2.
    发明公开
    Light emitting diode print head assembly 失效
    Aufbau eines Druckkopfes mit Leuchtdioden。

    公开(公告)号:EP0364077A2

    公开(公告)日:1990-04-18

    申请号:EP89307837.8

    申请日:1989-08-02

    CPC分类号: B41J2/45

    摘要: This technique for assembling a print head for an LED printer has LED dice (16) first assembled into precisely known locations on mounting tiles (13). A portion (19) of the front face of each tile (13) is left exposed beyond anything mounted on the tile (13). The tiles (13) are then assembled with these exposed areas (19) on a planar reference (32) on an assembly fixture (31). Reference surfaces (34,36) built into the fixture (31) align the edges of the tiles (13), and hence the LED dice (16). Finally a mother plate (10) is adhesively bonded onto the backs of the tiles (13). The adhesive accommodates thickness variations in the mounting tiles (13), and lack of flatness in the back surfaces of the tiles (13) and the front face of the mother plate (10). Reference tiles (41) coplanar with the reference plane formed by the front faces of the mounting tiles (13) provide a z axis reference.

    摘要翻译: 用于组装用于LED打印机的打印头的该技术具有首先在安装瓦片(13)上组装成精确已知位置的LED骰子(16)。 每个瓦片(13)的前表面的一部分(19)被暴露在安装在瓦片(13)上的任何东西上。 然后将瓦片(13)与这些暴露区域(19)组装在装配夹具(31)上的平面基准(32)上。 内置于固定装置(31)中的参考表面(34,36)对准瓦片(13)的边缘,并因此使LED骰子(16)对齐。 最后,母板(10)粘合到瓦片(13)的背面上。 粘合剂容纳安装瓦片(13)中的厚度变化,以及瓷砖(13)的后表面和母板(10)的前表面的平坦度不足。 与由安装瓦片(13)的前表面形成的参考平面共面的参考瓦片(41)提供z轴基准。