公开(公告)号：EP2597114A1

公开(公告)日：2013-05-29

申请号：EP12193872.4

申请日：2012-11-22

申请人： Hitachi Ltd.

发明人： Tanase, Tomokazu ,  Kagawa, Hiroyuki ,  Amou, Satoru

IPC分类号： C08K3/34 ,  C08K9/04 ,  C09D7/12 ,  C09D179/04 ,  C08L79/04

CPC分类号： C09D167/00 ,  B82Y30/00 ,  C08G73/0644 ,  C08G73/0655 ,  C08G73/0661 ,  C08K3/346 ,  C08K5/0091 ,  C08K5/17 ,  C08K9/04 ,  C09D7/62 ,  C09D7/70 ,  C09D179/04 ,  H01B3/303 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  C08L79/04 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides an organic-inorganic composite material having excellent thermal stability, electrical insulation and adhesiveness. The organic-inorganic composite material includes a resin composed of a triazine ring and obtained by thermally curing a varnish containing a mixture of a layered clay mineral (clay) subjected to interlayer modification with a curing catalyst for a cyanate ester compound and a cyanate ester compound, wherein the amount of the clay is from 0.1 to 12 wt% of the amount of the cyanate ester compound. The invention also provides a varnish which gives the organic-inorganic composite material, and an electrical device and a semiconductor device, each of which includes the organic-inorganic composite material.

摘要翻译： 本发明提供了在具有有机 - 无机复合材料优异的热稳定性，电绝缘性和粘合性。 所述有机 - 无机复合材料包括由热固化的清漆包含进行层间与固化催化剂的氰酸酯化合物和氰酸酯化合物改性的层状粘土矿物（粘土）的混合物中的三嗪环组成和得到的树脂 ，worin的粘土的量为0.1〜氰酸酯化合物的量为12重量％。 因此本发明提供的清漆其中给出的有机无机复合材料，和在电气设备和半导体器件，其中的每一个包括所述有机 - 无机复合材料。

公开(公告)号：EP2597114B1

公开(公告)日：2017-03-15

申请号：EP12193872.4

申请日：2012-11-22

申请人： Hitachi, Ltd.

发明人： Tanase, Tomokazu ,  Kagawa, Hiroyuki ,  Amou, Satoru

IPC分类号： C08K3/34 ,  C08K9/04 ,  C09D7/12 ,  C09D179/04 ,  C08L79/04

CPC分类号： C09D167/00 ,  B82Y30/00 ,  C08G73/0644 ,  C08G73/0655 ,  C08G73/0661 ,  C08K3/346 ,  C08K5/0091 ,  C08K5/17 ,  C08K9/04 ,  C09D7/62 ,  C09D7/70 ,  C09D179/04 ,  H01B3/303 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  C08L79/04 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides an organic-inorganic composite material having excellent thermal stability, electrical insulation and adhesiveness. The organic-inorganic composite material includes a resin composed of a triazine ring and obtained by thermally curing a varnish containing a mixture of a layered clay mineral (clay) subjected to interlayer modification with a curing catalyst for a cyanate ester compound and a cyanate ester compound, wherein the amount of the clay is from 0.1 to 12 wt% of the amount of the cyanate ester compound. The invention also provides a varnish which gives the organic-inorganic composite material, and an electrical device and a semiconductor device, each of which includes the organic-inorganic composite material.