公开(公告)号：EP2621255B1

公开(公告)日：2015-03-04

申请号：EP13165179.6

申请日：2008-10-01

申请人： Hoffman Enclosures, Inc.

发明人： Lakoduk, Harold, Dean ,  Schramske, Scott, Allen ,  Lange, Tim, Gordon ,  Messing, Kent, Gregory ,  Wacker, Ronald, Mathew ,  Kalstabakken, Robert, Marvin ,  Johnson, Steve, Jerome ,  Modrow, Sheldon, Odell ,  Ricke, Joseph, David

IPC分类号： H05K5/02 ,  H02B1/46 ,  E05B67/38 ,  E05B13/10 ,  H05K7/18

CPC分类号： H05K5/0226 ,  H02B1/012 ,  H02B1/46 ,  H05K5/0221 ,  H05K7/183 ,  Y10T29/49826 ,  Y10T70/7486 ,  Y10T292/1083 ,  Y10T292/1086

公开(公告)号：EP2621255A3

公开(公告)日：2013-10-30

申请号：EP13165179.6

申请日：2008-10-01

申请人： Hoffman Enclosures, Inc.

发明人： Lakoduk, Harold, Dean ,  Schramske, Scott, Allen ,  Lange, Tim, Gordon ,  Messing, Kent, Gregory ,  Wacker, Ronald, Mathew ,  Kalstabakken, Robert, Marvin ,  Johnson, Steve, Jerome ,  Modrow, Sheldon, Odell ,  Ricke, Joseph, David

IPC分类号： H05K5/02 ,  H02B1/46 ,  E05B67/38 ,  E05B13/10 ,  H05K7/18

CPC分类号： H05K5/0226 ,  H02B1/012 ,  H02B1/46 ,  H05K5/0221 ,  H05K7/183 ,  Y10T29/49826 ,  Y10T70/7486 ,  Y10T292/1083 ,  Y10T292/1086

摘要： Embodiments of the invention provide enclosures for electronic components and methods for manufacturing the same. In one embodiment, the enclosure includes first and second sidewalls formed from a single elongated piece of sheet metal. The first sidewall, the second sidewall, a third sidewall, and a fourth sidewall define an interior space of the enclosure. At least one of the first and second sidewalls includes an edge region folded inwardly relative to the interior space to form a mounting channel. The enclosure further includes a backwall coupled with first edges of the sidewalls and a door hingedly coupled with a second edge of at least one of the sidewalls.

公开(公告)号：EP2621255A2

公开(公告)日：2013-07-31

申请号：EP13165179.6

申请日：2008-10-01

申请人： Hoffman Enclosures, Inc.

发明人： Lakoduk, Harold, Dean ,  Schramske, Scott, Allen ,  Lange, Tim, Gordon ,  Messing, Kent, Gregory ,  Wacker, Ronald, Mathew ,  Kalstabakken, Robert, Marvin ,  Johnson, Steve, Jerome ,  Modrow, Sheldon, Odell ,  Ricke, Joseph, David

IPC分类号： H05K5/02 ,  H02B1/46

CPC分类号： H05K5/0226 ,  H02B1/012 ,  H02B1/46 ,  H05K5/0221 ,  H05K7/183 ,  Y10T29/49826 ,  Y10T70/7486 ,  Y10T292/1083 ,  Y10T292/1086

摘要： Embodiments of the invention provide enclosures for electronic components and methods for manufacturing the same. In one embodiment, the enclosure includes first and second sidewalls formed from a single elongated piece of sheet metal. The first sidewall, the second sidewall, a third sidewall, and a fourth sidewall define an interior space of the enclosure. At least one of the first and second sidewalls includes an edge region folded inwardly relative to the interior space to form a mounting channel. The enclosure further includes a backwall coupled with first edges of the sidewalls and a door hingedly coupled with a second edge of at least one of the sidewalls.

摘要翻译： 本发明的实施例提供用于电子部件的外壳及其制造方法。 在一个实施例中，外壳包括由单个细长金属片形成的第一和第二侧壁。 第一侧壁，第二侧壁，第三侧壁和第四侧壁限定了外壳的内部空间。 第一侧壁和第二侧壁中的至少一个包括相对于内部空间向内折叠以形成安装通道的边缘区域。 外壳还包括与侧壁的第一边缘连接的后壁和与至少一个侧壁的第二边缘铰接连接的门。