MIDDLE FRAME OF ELECTRONIC DEVICE, MIDDLE FRAME ASSEMBLY, AND ELECTRONIC DEVICE

    公开(公告)号:EP4205878A1

    公开(公告)日:2023-07-05

    申请号:EP22871041.4

    申请日:2022-09-07

    IPC分类号: B22D17/00 B22D17/22 H04M1/02

    摘要: Embodiments of this application disclose a middle frame of an electronic device, a middle frame assembly, and an electronic device. The embodiments of this application may be applied to a terminal product that includes a screen, for example, a mobile phone, a tablet computer, a handheld computer, a walkie-talkie, a POS machine, an event data recorder, a wearable device, a virtual reality device, or a vehicle-mounted front loading apparatus. The middle frame assembly includes a middle frame and a plastic part injection-molded on a surface of the middle frame. The middle frame includes a middle plate and a first accommodation chamber configured to accommodate a battery of the electronic device. There is a drainage material section on an outer side surface of the middle frame. The middle plate includes a first middle plate region for forming a bottom wall of the first accommodation chamber. The drainage material section is at least partially located between surfaces on which a top surface and a bottom surface of the first middle plate region are located. The middle frame has few sand holes, good quality, and high strength, to resolve a problem that overall strength and reliability of the electronic device are low due to poor forming quality and low strength of the middle frame.