公开(公告)号：EP4439965A1

公开(公告)日：2024-10-02

申请号：EP24166380.6

申请日：2024-03-26

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： LU, Fenglong ,  LIU, Shuai ,  CHEN, Dong ,  SHI, Lei

IPC: H02M7/5387 ,  H02M7/483 ,  H02M1/12 ,  H02M1/44 ,  H02M1/34 ,  H02P27/08

CPC classification number: H02M7/5387 ,  H02M1/12 ,  H02M1/123 ,  H02M1/126 ,  H02M1/44 ,  H02P2209/0120130101 ,  H02M7/487

Abstract: This application provides an inverter apparatus and a control method thereof. The inverter apparatus includes a direct current bus, a bus capacitor, an inverter bridge arm, a filter circuit, a switch unit, and a controller. The inverter bridge arm is connected to a positive direct current bus and a negative direct current bus, and the filter circuit is connected between the inverter bridge arm and a user load. In a working scenario in which the inverter apparatus switches between on-grid operation and off-grid operation, when the working scenario is on-grid operation and off-grid operation with a balanced load, an inverter uses a common-mode injection modulation mode; and when the working scenario is off-grid operation with an unbalanced load, the inverter uses a common SPWM modulation mode. This application is implemented, to improve working efficiency of the inverter in more working scenarios, and the implementation is simple, stable, reliable, and load-friendly.

公开(公告)号：EP4432545A1

公开(公告)日：2024-09-18

申请号：EP23899091.5

申请日：2023-11-16

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： GAO, Shen ,  LU, Fenglong ,  LIU, Shuai ,  SHI, Lei

IPC: H02M7/483

Abstract: This application provides an inverter and a control method thereof. The inverter is used in a power supply system. The inverter includes an inverter circuit, a collection circuit, a balanced circuit, and an inductor. The collection circuit is configured to detect a direct current bus voltage, to obtain end voltage values of a first capacitor and a second capacitor. The balanced circuit is configured to: when an end voltage value of a target capacitor is less than or equal to a first voltage threshold, control on or off of a plurality of switching transistors, to adjust a current for charging the target capacitor through the inductor and reduce a difference between the end voltage values of the target capacitor and a non-target capacitor in the two groups of capacitors. According to this application, when the difference between the end voltage values of the two groups of capacitors in the inverter circuit is large, the balanced circuit may adjust an output current of the inductor to charge the target capacitor. This reduces the difference between the end voltage values of the two groups of capacitors in the inverter circuit, and improves stability and power supply efficiency of the inverter. A structure is simple, and the method is simple with high applicability.

公开(公告)号：EP4340016A1

公开(公告)日：2024-03-20

申请号：EP23197590.5

申请日：2023-09-15

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： CHEN, Dong ,  LU, Fenglong ,  TANG, Yunyu ,  SHI, Lei ,  LIU, Yunfeng ,  LV, Shuyi ,  ZHANG, Pengcheng

IPC: H01L23/367 ,  H01L23/427

Abstract: This application provides a packaged device, where the packaged device includes a circuit board, an electronic component, and a heat storage portion. The electronic component is electrically connected to the circuit board; and the heat storage portion is disposed on the circuit board or embedded in the circuit board, and the heat storage portion is adjacent to the electronic component, where a specific heat capacity of the heat storage portion is higher than a specific heat capacity of the circuit board, and the heat storage portion is configured to store and release heat. This application further provides a packaged module and a power conversion device to which the packaged device is applied. A heat storage material with a relatively high specific heat capacity is introduced into the packaged device, and the heat storage portion is disposed on the circuit board around the electronic component, so that a large amount of heat generated by the electronic component in a short time can be quickly stored in the heat storage portion and then released to the outside, thereby reducing a risk of damage to the electronic component and improving reliability of the packaged device.