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公开(公告)号：EP0172267B1
公开(公告)日：1987-07-01
申请号：EP84109981.5
申请日：1984-08-22
发明人： Obata, Keigo , Dohi, Nobuyasu , Okuhama, Yoshiaki , Masaki, Seishi , Okada, Yukiyoshi , Yoshida, Tadashi
IPC分类号： C25D3/60
CPC分类号： C25D3/60 , H05K3/3473
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公开(公告)号：EP0172267A1
公开(公告)日：1986-02-26
申请号：EP84109981.5
申请日：1984-08-22
发明人： Obata, Keigo , Dohi, Nobuyasu , Okuhama, Yoshiaki , Masaki, Seishi , Okada, Yukiyoshi , Yoshida, Tadashi
IPC分类号： C25D3/60
CPC分类号： C25D3/60 , H05K3/3473
摘要： A tin-lead alloy plating bath based on a principal plating bath comprising an alkanesulfonic or alkanolsulfonic acid and both bivalent tin and lead salts thereof is characterized by the addition of a guanamine compound having the general formula
wherein R, and R 2 , which may be the same or different, present each a hydrogen atom, C 1-18 straight- or branched-chain alkyl radical, C 1-18 straight- or branched-chain alkoxy-lower alkyl radical, or a C 3-7 cycloalkyl radical, or R 1 and R 2 may combine to form a carbon cycle or hetero cycle, and A represents a lower alkylene radical.摘要翻译： 基于包含烷烃磺酸或链烷醇磺酸的二次锡和铅盐的主镀液的锡铅合金电镀槽的特征在于加入通式为CHEM的胍胺化合物，其中R 1和R 2可以 相同或不同，各自表示氢原子，C1-18直链或支链烷基，C1-18直链或支链烷氧基 - 低级烷基或C3-7环烷基，或R1和 R2可以结合形成碳循环或杂环，A代表低级亚烷基。
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公开(公告)号：EP0192273B1
公开(公告)日：1989-04-26
申请号：EP86102271.3
申请日：1986-02-21
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公开(公告)号：EP0192273A1
公开(公告)日：1986-08-27
申请号：EP86102271.3
申请日：1986-02-21
发明人： Obata, Keigo , Dohi, Nobuyasu , Okuhama, Yoshiaki , Masaki, Seishi , Okada, Yukiyoshi , Yoshimoto, Masakazu
摘要： A tin, lead, or tin-lead alloy plating bath comprising, as essential ingredients, an alkali metal salt, and a soluble divalent tin compound or/and a lead compound, all of an aliphatic or aromatic sulfocarboxylic acid of the general formula
wherein R is a C 1-4 hydrocarbon radical, M 1 is a hydrogen atom or alkali metal atom, M 2 is an alkali metal atom, and X 1 and X 2 are each a hydrogen atom, OH, COON, or SO 3 N (where N represents a hydrogen atom or alkali metal atom).
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