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公开(公告)号:EP2965860B1
公开(公告)日:2017-12-13
申请号:EP14759821.3
申请日:2014-03-10
申请人: IHI Corporation
发明人: ARAKI, Takahito , YANO, Masaharu , IMANARI, Kuniyuki , ISHITSU, Kouta , UEDA, Takashi , HOSOKAWA, Akira , FURUMOTO, Tatsuaki
IPC分类号: B23P25/00 , B23B1/00 , B23C9/00 , B23K26/00 , B23K26/352
CPC分类号: C04B41/0036 , B23C3/00 , B23C9/00 , B23C2222/61 , B23C2226/18 , B23C2226/27 , B23K26/0006 , B23K26/0066 , B23K26/0093 , B23K26/082 , B23K2203/52 , B23P25/006 , C04B41/009 , C04B41/53 , Y10T29/5107 , Y10T409/303808 , Y10T409/304032
摘要: A method for machining a ceramic matrix composite (CMC), the method enhancing a machining speed for the ceramic matrix composite (CMC), includes: a step of scanning an irradiated portion (32) of a surface of a machining target material (30) by a laser head (21) to irradiate the irradiated portion (32) with laser light from the laser head (21), and forming a deteriorated layer on the irradiated portion (32) of the surface of the machining target material (30); and a step of sequentially removing the deteriorated layer by an end mill (25), the deteriorated layer being formed on the irradiated portion (32), wherein the deteriorated layer is formed by heating the irradiated portion (32) up to a predetermined temperature by irradiation of continuous oscillation laser light, and by forming a crack by irradiation of pulsed oscillation laser light.
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公开(公告)号:EP2965860A1
公开(公告)日:2016-01-13
申请号:EP14759821.3
申请日:2014-03-10
申请人: IHI Corporation
发明人: ARAKI, Takahito , YANO, Masaharu , IMANARI, Kuniyuki , ISHITSU, Kouta , UEDA, Takashi , HOSOKAWA, Akira , FURUMOTO, Tatsuaki
IPC分类号: B23P25/00 , B23B1/00 , B23C9/00 , B23K26/00 , B23K26/352
CPC分类号: C04B41/0036 , B23C3/00 , B23C9/00 , B23C2222/61 , B23C2226/18 , B23C2226/27 , B23K26/0006 , B23K26/0066 , B23K26/0093 , B23K26/082 , B23K2203/52 , B23P25/006 , C04B41/009 , C04B41/53 , Y10T29/5107 , Y10T409/303808 , Y10T409/304032
摘要: A method for machining a ceramic matrix composite (CMC), the method enhancing a machining speed for the ceramic matrix composite (CMC), includes: a step of scanning an irradiated portion (32) of a surface of a machining target material (30) by a laser head (21) to irradiate the irradiated portion (32) with laser light from the laser head (21), and forming a deteriorated layer on the irradiated portion (32) of the surface of the machining target material (30); and a step of sequentially removing the deteriorated layer by an end mill (25), the deteriorated layer being formed on the irradiated portion (32), wherein the deteriorated layer is formed by heating the irradiated portion (32) up to a predetermined temperature by irradiation of continuous oscillation laser light, and by forming a crack by irradiation of pulsed oscillation laser light.
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