公开(公告)号：EP3097065A2

公开(公告)日：2016-11-30

申请号：EP15702110.6

申请日：2015-01-21

Applicant: II-VI Incorporated

Inventor： XU, Wen-Qing ,  EISSLER, Elgin E. ,  LIU, Chao ,  TANNER, Charles D. ,  KRAISINGER, Charles J. ,  AGHAJANIAN, Michael

IPC: C04B41/87

CPC classification number: C30B25/02 ,  C01B32/25 ,  C04B35/52 ,  C04B35/565 ,  C04B35/573 ,  C04B35/634 ,  C04B41/009 ,  C04B41/5002 ,  C04B41/85 ,  C04B2235/3826 ,  C04B2235/427 ,  C04B2235/5427 ,  C04B2235/5436 ,  C04B2235/602 ,  C04B2235/604 ,  C04B2235/6581 ,  C04B2235/77 ,  C04B2235/80 ,  C04B2235/96 ,  C04B2235/9607 ,  C23C16/274 ,  C23C16/279 ,  C23C16/463 ,  C23C16/56 ,  C23C28/04 ,  C23C28/046 ,  Y10T428/21 ,  Y10T428/24355 ,  Y10T428/24612 ,  Y10T428/24893 ,  Y10T428/26 ,  Y10T428/265 ,  Y10T428/30 ,  C04B41/4531

Abstract: A multilayer substrate includes a diamond layer CVD grown on a composite layer. The composite layer includes particles of diamond and silicon carbide and, optionally, silicon. A loading level (by volume) of diamond in the composite layer can be ≥ 5 %; ≥ 20 %; ≥ 40 %; or ≥ 60 %. The multilayer substrate can be used as an optical device; a detector for detecting radiation particles or electromagnetic waves; a device for cutting, drilling, machining, milling, lapping, polishing, coating, bonding, or brazing; a braking device; a seal; a heat conductor; an electromagnetic wave conductor; a chemically inert device for use in a corrosive environment, a strong oxidizing environment, or a strong reducing environment, at an elevated temperature, or under a cryogenic condition; or a device for polishing or planarization of other devices, wafers or films.