公开(公告)号：EP2395549B1

公开(公告)日：2014-06-25

申请号：EP10165504.1

申请日：2010-06-10

申请人： IMEC

发明人： Oprins, Herman ,  Vandevelde, Bart ,  Fiorini, Paolo ,  Beyne, Eric ,  De Vos, Joeri ,  Majeed, Bivragh

IPC分类号： H01L23/473

CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP2395549A1

公开(公告)日：2011-12-14

申请号：EP10165504.1

申请日：2010-06-10

申请人： IMEC

发明人： Oprins, Herman ,  Vandevelde, Bart ,  Fiorini, Paolo ,  Beyne, Eric ,  De Vos, Joeri ,  Majeed, Bivragh

IPC分类号： H01L23/473

CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention is related to a device for cooling the surface of a semiconductor device such as an integrated circuit or the like, said cooling device comprising a plurality of channels (3') which are non-parallel to the surface to be cooled, each channel comprising a plurality of separate electrodes (5) or equivalent conducting areas arranged along the length of each channel, the device further comprising or being connectable to means for applying a voltage to said electrodes or conducting areas in each channel according to a sequence, said sequence being such that a droplet (6) of cooling liquid in a channel may be moved from one electrode to the next, thereby transporting the droplet from the top of the channel to the bottom, from where the droplet impinges on the surface to be cooled.

摘要翻译： 本发明涉及一种用于冷却诸如集成电路等的半导体器件的表面的器件，所述冷却器件包括与待冷却表面不平行的多个通道（3'），每个通道 通道包括沿着每个通道的长度布置的多个分离的电极（5）或等效的导电区域，所述装置还包括或可连接到根据序列向每个通道中的所述电极或导电区域施加电压的装置，所述装置 顺序是使得通道中的冷却液体的液滴（6）可以从一个电极移动到下一个电极，从而将液滴从通道的顶部输送到底部，从而液滴撞击在待冷却的表面上 。