HEATING DEVICE
    1.
    发明公开
    HEATING DEVICE 审中-公开

    公开(公告)号:EP4257331A2

    公开(公告)日:2023-10-11

    申请号:EP23189990.7

    申请日:2021-07-07

    IPC分类号: B29C45/27

    摘要: Heating device (1) for locally heating of an injection mold cavity wall(2), comprising:
    -a base plate (3),
    an actuator (4) located on the base plate, to perform a linear movement;
    - a heated stamp (5) connected to the actuator (4) and driven by the actuator, to perform a linear movement in direction to and from the injection mold cavity wall (2); wherein the heated stamp (5) is located below the base plate and the actuator is located on top of the base plate, and wherein the base plate comprises an opening (6) through which a pin (7) extends for transferring the linear movement from the actuator to the heated stamp.

    HEATING DEVICE
    2.
    发明公开
    HEATING DEVICE 审中-公开

    公开(公告)号:EP4257331A3

    公开(公告)日:2024-01-03

    申请号:EP23189990.7

    申请日:2021-07-07

    IPC分类号: B29C45/73 B29C45/00 B29C45/27

    摘要: Heating device (1) for locally heating of an injection mold cavity wall(2), comprising:
    -a base plate (3),
    an actuator (4) located on the base plate, to perform a linear movement;
    - a heated stamp (5) connected to the actuator (4) and driven by the actuator, to perform a linear movement in direction to and from the injection mold cavity wall (2); wherein the heated stamp (5) is located below the base plate and the actuator is located on top of the base plate, and wherein the base plate comprises an opening (6) through which a pin (7) extends for transferring the linear movement from the actuator to the heated stamp.