公开(公告)号：EP4435841A1

公开(公告)日：2024-09-25

申请号：EP23209725.3

申请日：2023-11-14

申请人： INTEL Corporation

发明人： ALLEN, Gary ,  WALLACE, Charles ,  ENGEL, Clifford ,  GULER, Leonard ,  LIU, Shengsi ,  OBRIEN, Thomas ,  ZHU, Baofu ,  ACHARYA, Saurabh

IPC分类号： H01L21/768 ,  H01L23/485

CPC分类号： H01L23/485 ,  H01L21/76837 ,  H01L21/76895 ,  H01L21/7685

摘要： Techniques are provided herein to form semiconductor devices that include a contact over a given source or drain region that extends over the top of an adjacent source or drain region without contacting it. In an example, a semiconductor device includes a gate structure around a fin of semiconductor material that extends from a source or drain region, or one or more nanowires or nanoribbons or nanosheets of semiconductor material that extend from the source or drain region. A conductive contact is formed over the source or drain region that extends laterally across the source/drain trench above an adjacent source or drain region without contacting the adjacent source or drain region. The contact may extend along the source/drain trench through a dielectric wall (e.g., a gate cut) that extends orthogonally through the source/drain trench.

公开(公告)号：EP4435845A1

公开(公告)日：2024-09-25

申请号：EP23206291.9

申请日：2023-10-27

申请人： INTEL Corporation

发明人： GULER, Leonard ,  LIU, Shengsi ,  ACHARYA, Saurabh ,  OBRIEN, Thomas ,  GANESAN, Krishna ,  LAKHANI, Ankit ,  LUTHRA, Prabhjot ,  KHANDELWAL, Nidhi ,  ENGEL, Clifford ,  ZHU, Baofu ,  RAMANATHAN, Meenakshisundaram

IPC分类号： H01L21/8234 ,  H01L29/775

CPC分类号： H01L21/823481 ,  H01L21/823475 ,  H01L21/823437 ,  H01L21/823462 ,  H01L29/775

摘要： Techniques to form an integrated circuit having a gate cut between adjacent pairs of semiconductor devices. At least one of those adjacent pairs of semiconductor devices includes a conductive link (e.g., a bridge) through the gate cut to connect the adjacent gates together. In an example, neighboring semiconductor devices each include a semiconductor region extending between a source region and a drain region, and a gate structure extending over the semiconductor regions of the neighboring semiconductor devices. A gate cut is present between each pair of neighboring semiconductor devices thus interrupting the gate structure and isolating the gate of one semiconductor device from the gate of the other semiconductor device. A conductive link extends over a given gate cut to electrically connect the adjacent gate electrodes together. A dielectric layer extends over the bridged gate electrodes and the conductive link, and may have different thicknesses over those respective features.