专利检索 ap:("INTEL Corporation") AND inv:"SINGH, Navneet K." 第 1 页

1.

发明公开
SOLDERLESS OR GROUNDLESS ELECTROMAGNETIC SHIELDING IN ELECTRONIC DEVICES 审中-公开

公开(公告)号：EP4156880A1

公开(公告)日：2023-03-29

申请号：EP22188957.9

申请日：2022-08-05

申请人： INTEL Corporation

发明人： SUBRAMANYA, Bala P. , RAJU, Prakash Kurma , SINGH, Navneet K. , BEDARE, Sachin , R, Vijith Halestoph

IPC分类号： H05K9/00

摘要： An example electronic device is disclosed that includes a printed circuit board, an electronic component coupled to the printed circuit board, and a solderless shield coupled to the printed circuit board and covering the electronic component.