公开(公告)号：EP0619607A3

公开(公告)日：1994-11-02

申请号：EP94102895.3

申请日：1994-02-25

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Archambault, Helene ,  Boutin, Lynda ,  Kahn, Steven F. Robert ,  Lajza, John James, Jr. ,  Liutkus, John Joseph ,  Pare, Patrice ,  Peterson, Kirk David ,  Smith, Robert Michael ,  Tremblay, Stephane

IPC分类号： H01L23/495 ,  H01L23/31

CPC分类号： H01L23/293 ,  H01L23/3142 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/83101 ,  H01L2224/92147 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2224/05599

摘要： The invention provides a method of improving the adhesion between a polymeric adhesive (20, 22) and an encapsulating material (28) of the type used to encapsulate a semiconductor chip (14). The method involves the treatment of a polymeric adhesive so as to increase the number of bond sites to which the encapsulating material may adhere, thereby improving adhesion of the polymeric adhesive to the encapsulating material. The treatment may comprise oxidation, such as ozone oxidation, or high temperature baking, or plasma ashing, for example.

公开(公告)号：EP0619607A2

公开(公告)日：1994-10-12

申请号：EP94102895.3

申请日：1994-02-25

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Archambault, Helene ,  Boutin, Lynda ,  Kahn, Steven F. Robert ,  Lajza, John James, Jr. ,  Liutkus, John Joseph ,  Pare, Patrice ,  Peterson, Kirk David ,  Smith, Robert Michael ,  Tremblay, Stephane

IPC分类号： H01L23/495 ,  H01L23/31

CPC分类号： H01L23/293 ,  H01L23/3142 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/83101 ,  H01L2224/92147 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2224/05599

摘要： The invention provides a method of improving the adhesion between a polymeric adhesive (20, 22) and an encapsulating material (28) of the type used to encapsulate a semiconductor chip (14). The method involves the treatment of a polymeric adhesive so as to increase the number of bond sites to which the encapsulating material may adhere, thereby improving adhesion of the polymeric adhesive to the encapsulating material. The treatment may comprise oxidation, such as ozone oxidation, or high temperature baking, or plasma ashing, for example.

摘要翻译： 本发明提供了一种改进聚合物粘合剂（20,22）和用于封装半导体芯片（14）的类型的封装材料（28）之间的粘合性的方法。 该方法涉及聚合物粘合剂的处理，以增加封装材料可能粘附的粘合部位的数量，由此改善聚合物粘合剂与封装材料的粘合。 例如，该处理可以包括氧化，例如臭氧氧化，或高温烘焙，或等离子体灰化。