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公开(公告)号：EP0450313B1
公开(公告)日：1995-10-18
申请号：EP91103145.8
申请日：1991-03-02
CPC分类号： G11B5/6005 , B23K26/1224 , B23K26/361 , G11B5/3103 , G11B5/3106
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公开(公告)号：EP0450313A3
公开(公告)日：1993-03-03
申请号：EP91103145.8
申请日：1991-03-02
CPC分类号： G11B5/6005 , B23K26/1224 , B23K26/361 , G11B5/3103 , G11B5/3106
摘要： Laser etching of a substrate (28) in a liquid (12) is accomplished by laser induced sonic cavitation at the substrate surface. The preferred substrate (28) is laser (22) energy absorbing and has a finite melting temperature. The preferred liquid (12) is an organic or inorganic inert liquid which does not chemically react with the substrate (28) at room temperature. The laser (22) is preferably a copper vapor laser but a chopped beam cw argon ion laser or a YAG laser adjusted to a low power output sufficient to avoid the formation of a recast layer can also be used. The laser (22) parameters are adjusted for causing the growth and collapse of bubbles at the substrate surface. The laser etching has particular application in the fabrication of rails (46) in magnetic head sliders and dicing of Al₂O₃-TiC, TiC, SiC, Si/SiO₂, and laser energy absorbing metal and metal oxides.
摘要翻译： 在液体（12）中的基底（28）的激光蚀刻通过在基底表面处的激光诱导的声空穴实现。 优选的基底（28）是激光（22）能量吸收并且具有有限的熔融温度。 优选的液体（12）是在室温下不与基底（28）发生化学反应的有机或无机惰性液体。 激光器（22）优选是铜蒸气激光器，但是也可以使用调节到足以避免形成重铸层的低功率输出的切碎光束cw氩离子激光器或YAG激光器。 调整激光（22）参数以引起基板表面上气泡的生长和塌陷。 激光蚀刻特别适用于磁头滑块中的导轨（46）的制造和Al2O3-TiC，TiC，SiC，Si / SiO2和激光能量吸收金属和金属氧化物的切割。
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3.发明公开
公开(公告)号：EP0450313A2
公开(公告)日：1991-10-09
申请号：EP91103145.8
申请日：1991-03-02
CPC分类号： G11B5/6005 , B23K26/1224 , B23K26/361 , G11B5/3103 , G11B5/3106
摘要： Laser etching of a substrate (28) in a liquid (12) is accomplished by laser induced sonic cavitation at the substrate surface. The preferred substrate (28) is laser (22) energy absorbing and has a finite melting temperature. The preferred liquid (12) is an organic or inorganic inert liquid which does not chemically react with the substrate (28) at room temperature. The laser (22) is preferably a copper vapor laser but a chopped beam cw argon ion laser or a YAG laser adjusted to a low power output sufficient to avoid the formation of a recast layer can also be used. The laser (22) parameters are adjusted for causing the growth and collapse of bubbles at the substrate surface. The laser etching has particular application in the fabrication of rails (46) in magnetic head sliders and dicing of Al₂O₃-TiC, TiC, SiC, Si/SiO₂, and laser energy absorbing metal and metal oxides.
摘要翻译： 在液体（12）中的基底（28）的激光蚀刻通过在基底表面处的激光诱导的声空穴实现。 优选的基底（28）是激光（22）能量吸收并且具有有限的熔融温度。 优选的液体（12）是在室温下不与基底（28）发生化学反应的有机或无机惰性液体。 激光器（22）优选是铜蒸气激光器，但是也可以使用调节到足以避免形成重铸层的低功率输出的切碎光束cw氩离子激光器或YAG激光器。 调整激光（22）参数以引起基板表面上气泡的生长和塌陷。 激光蚀刻特别适用于磁头滑块中的导轨（46）的制造和Al2O3-TiC，TiC，SiC，Si / SiO2和激光能量吸收金属和金属氧化物的切割。
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