公开(公告)号：EP1501665B1

公开(公告)日：2006-03-15

申请号：EP03719044.4

申请日：2003-05-07

申请人： Inter Ikea Systems B.V.

发明人： ISAKSSON, Jan ,  NILSSON, Bo

IPC分类号： B27N3/14

CPC分类号： B27N3/14 ,  Y10T428/253 ,  Y10T428/31942 ,  Y10T428/31957 ,  Y10T428/31971 ,  Y10T428/31982 ,  Y10T428/31986 ,  Y10T428/31989

摘要： A chip board including an intermediary layer (1) and a layer (2) of large chips positioned on both sides of said intermediary layer. An outer layer (3) is provided on the 5 outer surface of each layer of large chips. In addition to the chips, the layers include an adhesive. The intermediary layer (1) includes a mixture of wood chips having chip fractions of a chip size of 0.1 to 20 mm, and the chips of this layer are randomly oriented. The individual chip in the layer (2) of large chips presents the following characteristics: a length of approx. 50 to approx. 130 mm, a width of approx. 4 to approx. 40 mm and a thickness of approx. 0.2 to approx. 2.0 mm. The chips within each layer (2) of large chips are all oriented in one and the same direction. As a result, a chip board is obtained which demonstrates a significantly higher E- module and stiffness in flexure than hitherto known despite a reduced consumption of material.

摘要翻译： 一种芯片板，包括中间层（1）和位于所述中间层两侧的大芯片层（2）。 外层（3）设置在每层大芯片的外表面上。 除了芯片之外，这些层还包括粘合剂。 中间层（1）包括芯片尺寸为0.1至20mm的木片的混合物，并且该层的芯片是随机定向的。 大芯片层（2）中的单个芯片具有以下特征： 50至约。 130毫米，宽度约。 4至约。 40毫米，厚度约。 0.2至约。 2.0毫米。 大芯片的每层（2）内的芯片全都以同一个方向取向。 结果，获得了一种芯片板，该芯片板尽管材料消耗减少，但显示出比迄今已知的显着更高的E-模块和挠曲刚度。

公开(公告)号：EP1501665A1

公开(公告)日：2005-02-02

申请号：EP03719044.4

申请日：2003-05-07

申请人： Inter Ikea Systems B.V.

发明人： ISAKSSON, Jan ,  NILSSON, Bo

IPC分类号： B27N3/14

CPC分类号： B27N3/14 ,  Y10T428/253 ,  Y10T428/31942 ,  Y10T428/31957 ,  Y10T428/31971 ,  Y10T428/31982 ,  Y10T428/31986 ,  Y10T428/31989

摘要： A chip board including an intermediary layer (1) and a layer (2) of large chips positioned on both sides of said intermediary layer. An outer layer (3) is provided on the 5 outer surface of each layer of large chips. In addition to the chips, the layers include an adhesive. The intermediary layer (1) includes a mixture of wood chips having chip fractions of a chip size of 0.1 to 20 mm, and the chips of this layer are randomly oriented. The individual chip in the layer (2) of large chips presents the following characteristics: a length of approx. 50 to approx. 130 mm, a width of approx. 4 to approx. 40 mm and a thickness of approx. 0.2 to approx. 2.0 mm. The chips within each layer (2) of large chips are all oriented in one and the same direction. As a result, a chip board is obtained which demonstrates a significantly higher E- module and stiffness in flexure than hitherto known despite a reduced consumption of material.

摘要翻译： 一种芯片板，包括中间层（1）和位于所述中间层两侧的大芯片层（2）。 外层（3）设置在每个大芯片层的外表面上。 除了芯片之外，这些层包括粘合剂。 中间层（1）包括具有芯片尺寸为0.1至20mm的芯片部分的木片的混合物，并且该层的芯片是随机取向的。 大芯片层（2）中的单个芯片具有以下特征： 50到约 130毫米，宽约 4到约 40毫米，厚度约 0.2〜约 2.0毫米。 大芯片每层（2）内的芯片均朝同一方向取向。 因此，尽管材料的消耗减少，但是获得了一种芯片板，其表现出比迄今为止已知的更高的E模块和弯曲刚度。