Treatment of polymer substrates
    1.
    发明公开
    Treatment of polymer substrates 失效
    Behandlung von polymeren Substraten。

    公开(公告)号:EP0294531A2

    公开(公告)日:1988-12-14

    申请号:EP87311340.1

    申请日:1987-12-23

    摘要: A process for improving the flame retardancy, hygroscopic, soil release and other properties of a polymer substrate is provided in which the substrate is contacted with a suitable aqueous mixture containing a water-soluble monomer and an organic halogen-containing hydrophobic carrier compound at a temperature of between about 40°C to 100°C. Polymerization of the monomer is thereafter initiated by a chemical or physical initiator to form a polymer evenly disposed on the substrate. The flame retardancy, hygroscopic, soil release and other surface properties of the substrate are thereby improved. The mixture may be in the form of an emulsion wherein the hydrophobic carrier compound is emulsified by an appropriate agent. The invention also pertains to the improved substrates prepared in accordance with the present process.

    摘要翻译: 提供了一种用于改善聚合物基材的阻燃性,吸湿性,污垢释放性和其它性能的方法,其中将基材与含有水溶性单体和含有机卤素的疏水性载体化合物的合适的含水混合物在温度 在约40℃至100℃之间。然后通过化学或物理引发剂引发单体的聚合,以形成均匀地设置在基材上的聚合物。 从而改善了基材的阻燃性,吸湿性,污垢释放性和其它表面性能。 混合物可以是乳液的形式,其中疏水性载体化合物被适当的试剂乳化。 本发明还涉及根据本方法制备的改进的底物。

    Treatment of polymer substrates
    2.
    发明公开
    Treatment of polymer substrates 失效
    聚合物基材的处理

    公开(公告)号:EP0294531A3

    公开(公告)日:1989-11-15

    申请号:EP87311340.1

    申请日:1987-12-23

    摘要: A process for improving the flame retardancy, hygroscopic, soil release and other properties of a polymer substrate is provided in which the substrate is contacted with a suitable aqueous mixture containing a water-soluble monomer and an organic halogen-containing hydrophobic carrier compound at a temperature of between about 40°C to 100°C. Polymerization of the monomer is thereafter initiated by a chemical or physical initiator to form a polymer evenly disposed on the substrate. The flame retardancy, hygroscopic, soil release and other surface properties of the substrate are thereby improved. The mixture may be in the form of an emulsion wherein the hydrophobic carrier compound is emulsified by an appropriate agent. The invention also pertains to the improved substrates prepared in accordance with the present process.