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1.发明公开Process for forming a metallurgical system comprising a bottom layer of nickel and a top layer of gold 失效一种制备镍的基底层和金冶金综合系统的顶层的过程。
公开(公告)号：EP0203423A1
公开(公告)日：1986-12-03
申请号：EP86106186.9
申请日：1986-05-06
发明人： Adwalpalker, Avinash Sripad , Harvilchuck, Joseph Matthew , Ranalli, Joseph Rocco , Rich, David William
CPC分类号： C04B41/009 , B23K20/233 , B23K35/001 , C04B41/52 , C04B41/89 , C04B2111/00844 , H01L21/4846 , H01L21/4853 , H01L2224/48463 , H01R43/16 , H05K3/24 , C04B41/5144 , C04B41/4572 , C04B41/5116 , C04B41/53 , C04B35/00
摘要： The process comprises placing a nickel layer on the metallized portion of the substrate and then covering the nickel with an immersion layer of gold. The gold immersion layer is chemically stripped followed by depoiting thick gold over said nickel and diffusing said thick gold into said nickel.
The process is particularly applied in making thermocompression bonds to a metallized ceramic substrate on which semiconductor chips are to be mounted and eletrically contacted.摘要翻译： 该方法包括放置一个镍层在基片上的金属化部分，然后在金浸渍层与覆盖镍。 金浸渍层通过depoiting厚的金在镍说和所述扩散厚的金到所述镍汽提，化学其次。 ... 该方法特别是在制造热压键合到其上的半导体芯片将被安装和eletrically接触的金属化陶瓷基片的应用。
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2.发明授权
公开(公告)号：EP0203423B1
公开(公告)日：1989-09-27
申请号：EP86106186.9
申请日：1986-05-06
发明人： Adwalpalker, Avinash Sripad , Harvilchuck, Joseph Matthew , Ranalli, Joseph Rocco , Rich, David William
CPC分类号： C04B41/009 , B23K20/233 , B23K35/001 , C04B41/52 , C04B41/89 , C04B2111/00844 , H01L21/4846 , H01L21/4853 , H01L2224/48463 , H01R43/16 , H05K3/24 , C04B41/5144 , C04B41/4572 , C04B41/5116 , C04B41/53 , C04B35/00
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