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1.发明公开Method for visual inspection of multilayer printed circuit boards 失效Verfahren zur visuellen Untersuchung von mehrschichtigen gedruckten Schaltungsplatten。
公开(公告)号：EP0239017A2
公开(公告)日：1987-09-30
申请号：EP87104084.6
申请日：1987-03-20
IPC分类号： G01N21/88
CPC分类号： G01N21/8803 , G01N21/6447 , G01N2021/95638 , H05K1/0269 , H05K3/4676 , H05K2203/161
摘要： A method is disclosed for the visual inspection of electrical circuitry deposited in the layers of a multilayer printed circuit board wherein the dielectric layers of the multilayer board are prepared using a clear, light transparent thermosetting resin having incorporated therein a dye which is permeable to visible light but which absorbs ultraviolet light in the 320-440 nm region.
The electrical circuitry in the board can be easily traced by an observer upon illumination of the board by visible light.摘要翻译： 公开了一种用于目视检查沉积在多层印刷电路板的层中的电路的方法，其中多层板的电介质层是使用透明的透光的热固性树脂来制备的，该热固性树脂中掺入了可渗透可见光的染料 但它吸收320-440 nm区域的紫外线。 当通过可见光照射电路板时，电路板中的电路可以很容易地被观察者跟踪。
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2.发明公开Process for activating a substrate for electroless deposition of a conductive metal 失效Verfahren zum Aktivieren einesTrägersfürstromloseleitfähigeMetallabscheidung。
公开(公告)号：EP0163089A2
公开(公告)日：1985-12-04
申请号：EP85104589.8
申请日：1985-04-17
CPC分类号： H05K3/048 , G03F7/095 , H05K3/184 , H05K2203/0577
摘要： A substrate is activated by providing a first resist thereon; followed by a second resist on the first resist. The first and second resists differ in their solubility characteristics. The resists are exposed to imaging radiation and developed. The substrate is seeded and the second resist layer is removed, thereby removing seeder, except from exposed areas of the substrate.
摘要翻译： 通过在其上提供第一抗蚀剂来激活衬底; 其次是第一抗蚀剂上的第二抗蚀剂。 第一和第二抗蚀剂的溶解度特性不同。 抗蚀剂暴露于成像辐射并显影。 将基板接种并除去第二抗蚀剂层，从而除去基材的暴露区域以外的播种机。
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公开(公告)号：EP0239017B1
公开(公告)日：1991-01-30
申请号：EP87104084.6
申请日：1987-03-20
IPC分类号： G01N21/88
CPC分类号： G01N21/8803 , G01N21/6447 , G01N2021/95638 , H05K1/0269 , H05K3/4676 , H05K2203/161
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公开(公告)号：EP0239017A3
公开(公告)日：1988-07-27
申请号：EP87104084
申请日：1987-03-20
IPC分类号： G01N21/88
CPC分类号： G01N21/8803 , G01N21/6447 , G01N2021/95638 , H05K1/0269 , H05K3/4676 , H05K2203/161
摘要： A method is disclosed for the visual inspection of electrical circuitry deposited in the layers of a multilayer printed circuit board wherein the dielectric layers of the multilayer board are prepared using a clear, light transparent thermosetting resin having incorporated therein a dye which is permeable to visible light but which absorbs ultraviolet light in the 320-440 nm region. The electrical circuitry in the board can be easily traced by an observer upon illumination of the board by visible light.
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6.发明授权Process for activating a substrate for electroless deposition of a conductive metal 失效用于激活用于导电金属的电沉积的基板的方法
公开(公告)号：EP0163089B1
公开(公告)日：1988-08-10
申请号：EP85104589.8
申请日：1985-04-17
CPC分类号： H05K3/048 , G03F7/095 , H05K3/184 , H05K2203/0577
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7.发明公开Method for conditioning of a substrate to be electrolessly plated 失效Verfahren zur Vorbehandlung eines底物fürdie stromlose Metallisierung。
公开(公告)号：EP0268821A1
公开(公告)日：1988-06-01
申请号：EP87115344.1
申请日：1987-10-20
IPC分类号： C23C18/22
摘要： A dielectric surface is conditioned for electroless plating of a conductive metal thereon by exposing the substrate to a gaseous plasma obtained from ammonia and/or an organic amine. The conditioning can be in the holes and/or on the surfaces of the substrate.
摘要翻译： 通过将基板暴露于由氨和/或有机胺获得的气态等离子体，调理电介质表面以对其上的导电金属进行无电镀。 调理可以在基底的孔和/或表面上。
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8.发明公开Process for activating a substrate for electroless deposition of a conductive metal 失效用于激活用于导电金属的电沉积的基板的方法
公开(公告)号：EP0163089A3
公开(公告)日：1987-07-29
申请号：EP85104589
申请日：1985-04-17
CPC分类号： H05K3/048 , G03F7/095 , H05K3/184 , H05K2203/0577
摘要： A substrate is activated by providing a first resist thereon; followed by a second resist on the first resist. The first and second resists differ in their solubility characteristics. The resists are exposed to imaging radiation and developed. The substrate is seeded and the second resist layer is removed, thereby removing seeder, except from exposed areas of the substrate.
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