公开(公告)号：EP4011593A1

公开(公告)日：2022-06-15

申请号：EP21158443.8

申请日：2021-02-22

申请人： Intops. Co., Ltd.

发明人： HONG, Tae Yong ,  AHN, Jun Young

IPC分类号： B29C45/16 ,  B29C45/14 ,  H05K3/00 ,  H05K3/10 ,  H05K3/42

摘要： An in-mold electronic structure according to the present invention comprises a film with a design; a first plastic resin disposed under the film, and a second plastic resin disposed under the first plastic resin, wherein an electronic circuit is formed on a top side or both sides of the second plastic resin, wherein an electronic device is mounted on the top side or the both sides of the second plastic resin, wherein the film, the first plastic resin, and the second resin with the electronic circuit and the electronic device, are integrated.