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公开(公告)号:EP4328953A3
公开(公告)日:2024-06-12
申请号:EP24151810.9
申请日:2018-01-22
发明人: ODA, Kunihiro , ASANO, Takayuki
IPC分类号: C23C14/34 , C04B35/58 , C23C14/06 , C01B33/06 , C04B35/645 , H01J37/34 , C04B35/626
CPC分类号: C23C14/0682 , C04B35/58092 , C04B2235/72320130101 , C04B2235/7920130101 , C04B2235/78620130101 , C04B2235/389120130101 , C04B2235/389520130101 , C04B2235/543620130101 , C04B2235/42820130101 , C01B33/06 , C04B35/645 , C04B2235/658120130101 , C04B35/6261 , C04B2235/7220130101 , C23C14/3414 , H01J37/3426 , H01J37/3491
摘要: A tungsten silicide target capable of suppressing the occurrence of particles during sputtering is provided by a method different from conventional methods. The tungsten silicide target includes not more than 5 low-density semi-sintered portions having a size of 50 µm or more per 80000 mm2 on the sputtering surface.
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公开(公告)号:EP4328953A2
公开(公告)日:2024-02-28
申请号:EP24151810.9
申请日:2018-01-22
发明人: ODA, Kunihiro , ASANO, Takayuki
IPC分类号: H01J37/34
摘要: A tungsten silicide target capable of suppressing the occurrence of particles during sputtering is provided by a method different from conventional methods. The tungsten silicide target includes not more than 5 low-density semi-sintered portions having a size of 50 µm or more per 80000 mm 2 on the sputtering surface.
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