公开(公告)号：EP2864405A4

公开(公告)日：2016-04-20

申请号：EP13797724

申请日：2013-05-21

Applicant: KAMIN LLC

Inventor： CHEN CHING YIH ,  CARTER RICHARD DOUGLAS ,  NOBLES BRENT ASHLEY

IPC: C08K3/22 ,  C08K5/00 ,  C09D11/00

CPC classification number: C08K3/346 ,  C08K5/09 ,  C08K5/17 ,  C08K5/5403 ,  C08K9/04 ,  C09D11/037 ,  C09D11/10 ,  C09D11/101

Abstract: In some variations, this disclosure provides a surface-modified hydrophobic clay composition for an ink formulation, the composition comprising up to 99 wt % clay particles with a particle-size distribution characterized in that at least 10% are smaller than 0.2 microns, at least 25% are smaller than 0.5 microns, and at least 95% are less than 5 microns; and from about 1 wt % to about 10 wt % of one or more organic compounds selected from quaternary ammonium compounds, organic acids, fatty acids, organic silanes, or organic polysilanes. The surface-modified hydrophobic clay composition may be produced by various methods, including a slurry method or a dry-mixing method. Ink clay loadings in heatset ink formulations may be increased to 10-15% without losing ink gloss. Inks may be produced with lower solvent, resin, and/or pigment concentrations, thereby reducing cost.