公开(公告)号：EP3660068A1

公开(公告)日：2020-06-03

申请号：EP18837842.6

申请日：2018-06-29

申请人： KCC Corporation

发明人： PARK, Ji Seung ,  PARK, Chan Young ,  SHIM, Myoung Taek ,  JEON, Ki Young ,  LEE, Sang Sun

IPC分类号： C08G59/02 ,  C08K5/3445 ,  C08K5/3492 ,  C08G59/62 ,  C08K5/5415 ,  C08K5/14 ,  C08K5/5313 ,  C08K3/017 ,  H01L23/29

摘要： The present invention provides an epoxy resin composition comprising an epoxy resin, a curing agent, a coupling agent, a curing accelerator, and an adhesion promotor, the adhesion promotor comprising an imidazole-based compound having an average particle size of 0.1-5 µm, and a semiconductor device comprising the same. The epoxy resin composition of the present invention has high adhesion to a different kind of material, such as copper, nickel, or silver, and thus, may satisfy a high level of reliability required for a semiconductor for a car, such as MSL or TCT.