SPECTRAL MATCHING BASED CALIBRATION
    2.
    发明公开
    SPECTRAL MATCHING BASED CALIBRATION 有权
    基于光谱匹配的标定

    公开(公告)号:EP2783392A1

    公开(公告)日:2014-10-01

    申请号:EP12852321.4

    申请日:2012-11-20

    CPC classification number: G01N21/274 G01N21/211 G03F7/70608

    Abstract: Methods and systems for calibrating system parameter values of a target inspection system are presented. Spectral Error Based Calibration (SEBC) increases consistency among inspection systems by minimizing differences in the spectral error among different inspection systems for a given specimen or set of specimens. The system parameter values are determined such that differences between a spectral error associated with a measurement of a specimen by the target inspection system and a spectral error associated with a measurement of the same specimen by a reference inspection system are minimized. In some examples, system parameter values are calibrated without modifying specimen parameters. Small inaccuracies in specimen parameter values have little effect on the calibration because the target system and the reference system both measure the same specimen or set of specimens. By performing SEBC over a set of specimens, the resulting calibration is robust to a wide range of specimens under test.

    Abstract translation: 介绍了用于校准目标检查系统的系统参数值的方法和系统。 基于光谱误差的校准(SEBC)通过最小化不同检测系统之间对于给定样本或样本组的不同检测系统的差异来增加检测系统之间的一致性。 系统参数值被确定为使得与由目标检查系统对样本的测量相关联的光谱误差与由参考检查系统对相同样本的测量相关联的光谱误差之间的差异被最小化。 在一些示例中,系统参数值被校准而无需修改样本参数。 样本参数值的小误差对校准影响不大,因为目标系统和参考系统都测量同一个样本或一组样本。 通过在一组样本上进行SEBC,所得到的校准对大范围的待测样本是稳健的。

    HIGH THROUGHPUT THIN FILM CHARACTERIZATION AND DEFECT DETECTION
    3.
    发明公开
    HIGH THROUGHPUT THIN FILM CHARACTERIZATION AND DEFECT DETECTION 审中-公开
    薄膜贴标签和高通量故障检测

    公开(公告)号:EP2761272A2

    公开(公告)日:2014-08-06

    申请号:EP12837177.0

    申请日:2012-09-25

    Abstract: Methods and systems for determining band structure characteristics of high-k dielectric films deposited over a substrate based on spectral response data are presented. High throughput spectrometers are utilized to quickly measure semiconductor wafers early in the manufacturing process. Optical dispersion metrics are determined based on the spectral data. Band structure characteristics such as band gap, band edge, and defects are determined based on optical dispersion metric values. In some embodiments a band structure characteristic is determined by curve fitting and interpolation of dispersion metric values. In some other embodiments, band structure characteristics are determined by regression of a selected dispersion model. In some examples, band structure characteristics indicative of band broadening of high-k dielectric films are also determined. The electrical performance of finished wafers is estimated based on the band structure characteristics identified early in the manufacturing process.

    SPECTRAL MATCHING BASED CALIBRATION
    4.
    发明授权
    SPECTRAL MATCHING BASED CALIBRATION 有权
    基于光谱匹配的标定

    公开(公告)号:EP2783392B1

    公开(公告)日:2016-09-14

    申请号:EP12852321.4

    申请日:2012-11-20

    CPC classification number: G01N21/274 G01N21/211 G03F7/70608

    Abstract: Methods and systems for calibrating system parameter values of a target inspection system are presented. Spectral Error Based Calibration (SEBC) increases consistency among inspection systems by minimizing differences in the spectral error among different inspection systems for a given specimen or set of specimens. The system parameter values are determined such that differences between a spectral error associated with a measurement of a specimen by the target inspection system and a spectral error associated with a measurement of the same specimen by a reference inspection system are minimized. In some examples, system parameter values are calibrated without modifying specimen parameters. Small inaccuracies in specimen parameter values have little effect on the calibration because the target system and the reference system both measure the same specimen or set of specimens. By performing SEBC over a set of specimens, the resulting calibration is robust to a wide range of specimens under test.

    MULTI-ANALYZER ANGLE SPECTROSCOPIC ELLIPSOMETRY
    5.
    发明公开
    MULTI-ANALYZER ANGLE SPECTROSCOPIC ELLIPSOMETRY 审中-公开
    多分析仪角度光谱椭偏仪

    公开(公告)号:EP2729789A1

    公开(公告)日:2014-05-14

    申请号:EP12807285.7

    申请日:2012-07-03

    CPC classification number: G01J4/00 G01N21/211 G01N2021/213

    Abstract: Ellipsometry systems and ellipsometry data collection methods with improved stabilities are disclosed. In accordance with the present disclosure, multiple predetermined, discrete analyzer angles are utilized to collect ellipsometry data for a single measurement, and data regression is performed based on the ellipsometry data collected at these predetermined, discrete analyzer angles. Utilizing multiple discrete analyzer angles for a single measurement improves the stability of the ellipsometry system.

    Abstract translation: 公开了具有改进的稳定性的椭圆偏光测量系统和椭圆偏光测量数据收集方法。 根据本公开,利用多个预定的离散分析器角度来收集用于单次测量的椭圆偏光测量数据,并且基于以这些预定离散分析仪角度收集的椭圆偏振数据来执行数据回归。 利用多个离散分析仪角度进行单次测量,可以提高椭偏仪系统的稳定性。

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