LIGHT SOURCE MODULE
    3.
    发明公开
    LIGHT SOURCE MODULE 审中-公开
    LICHTQUELLENMODUL

    公开(公告)号:EP2685154A1

    公开(公告)日:2014-01-15

    申请号:EP12754713.1

    申请日:2012-02-14

    IPC分类号: F21S8/10 F21Y101/02

    摘要: To efficiently release heat generated by a semiconductor light emitting device. This object is achieved by a light source module including a circuit board having a surface on which a semiconductor light emitting device is mounted and adapted to be placed on a mounting base of a light source holding member, and a power feeding attachment to supply power to the semiconductor light emitting device, the circuit board including a board part on which the semiconductor light emitting device is mounted, and a conductive circuit formed on a surface of the board part and having a pair of terminal parts and a light source connection part to connect the pair of terminal parts and the semiconductor light emitting device, the power feeding attachment including an electrically-insulating portion formed of an electrically-insulating material having higher thermal conductivity than the board part, and an conductive portion embedded in the electrically-insulating portion except a portion thereof, the power feeding attachment being adapted to be attached to the light source holding member such that the electrically-insulating portion presses at least a portion of the circuit board against the mounting base.

    摘要翻译: 为了有效地释放由半导体发光器件产生的热量。 该目的通过一种光源模块来实现,该光源模块包括具有安装有半导体发光器件的表面的电路板,并且适于放置在光源保持部件的安装基座上,以及馈电附件,用于向 半导体发光器件,包括其上安装有半导体发光器件的板部分的电路板和形成在板部分的表面上并具有一对端子部分和光源连接部分以连接的导电电路 所述一对端子部件和半导体发光器件,所述馈电附件包括由电绝缘材料形成的电绝缘部分,所述电绝缘材料具有比所述板部分更高的热导率,以及导电部分,其嵌入在所述电绝缘部分中, 其一部分,所述供电附件适于附接到所述光源保持件 使得电绝缘部分将电路板的至少一部分压靠在安装基座上。