-
公开(公告)号：EP2541565A1
公开(公告)日：2013-01-02
申请号：EP12173791.0
申请日：2012-06-27
Applicant: Kemet Electronics Corporation
Inventor： McConnell, John , Bultitude, John , Jones, Lonnie , Webster, Alan
Abstract: A stacked leaded array is provided wherein the stacked leaded array allows for increased packing density of electronic components (21). The stacked leaded array has a multiplicity of electronic components (21) in a stacked array. Each electronic component (21) comprises a first termination (20) and a second termination (22). A multiplicity of first leads (28,28') are provided wherein each first lead (28,28') is in electrical contact with at least one first termination (20). Second leads (26) are in electrical contact with second terminations (22).
Abstract translation: 提供了堆叠的引线阵列，其中堆叠的引线阵列允许增加电子部件（21）的封装密度。 堆叠引线阵列具有堆叠阵列中的多个电子部件（21）。 每个电子部件（21）包括第一终端（20）和第二终端（22）。 提供多个第一引线（28,28'），其中每个第一引线（28,28'）与至少一个第一端接件（20）电接触。 第二引线（26）与第二端接（22）电接触。
-
公开(公告)号：EP2541565B1
公开(公告)日：2016-06-15
申请号：EP12173791.0
申请日：2012-06-27
Applicant: Kemet Electronics Corporation
Inventor： McConnell, John , Bultitude, John , Jones, Lonnie , Webster, Alan
-
Search Results
2
records
(took 0.012 seconds)
