WAFER ALIGNMENT
    1.
    发明公开
    WAFER ALIGNMENT 审中-公开
    WAFERAUSRICHTUNG

    公开(公告)号:EP1180251A1

    公开(公告)日:2002-02-20

    申请号:EP01918374.8

    申请日:2001-03-05

    IPC分类号: G03F9/00

    CPC分类号: G03F9/7092 G03F9/7076

    摘要: A method for determining the centroid of a wafer target. In one embodiment, the method comprises a series of steps in a stepper, starting with the step of receiving a wafer, having a target set formed therein. Next, a signal is passed over the target set and over a material separating target shapes in the target set. Then a return signal is reflected, and received, from the surface of the target shapes and the material separating them. A location of at least one maxima point of the return signal is identified. Finally, a centroid is determined as the median of the locations of at least one maxima point.