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    CAPACITIVE MICRO-MACHINED ULTRASOUND TRANSDUCER CELL
    4.
    发明公开
    CAPACITIVE MICRO-MACHINED ULTRASOUND TRANSDUCER CELL 审中-公开
    静电电容式微型超声波换能器CELL

    公开(公告)号：EP3038763A1

    公开(公告)日：2016-07-06

    申请号：EP14752331.0

    申请日：2014-08-18

    申请人： Koninklijke Philips N.V.

    发明人： BROCK-FISHER, George Anthony ,  DAVIDSEN, Richard Edward ,  HERICKHOFF, Carl Dean ,  MARCELIS, Bout ,  SUDOL, Wojtek ,  SONG, Junho

    IPC分类号： B06B1/02 ,  G10K11/00

    CPC分类号： B06B1/0292 ,  A61B8/4494 ,  G10K11/002

    摘要： The invention relates to a capacitive micro-machined ultrasound transducer (CMUT) cell (6) comprising a cell floor (31) having a first electrode (7); a cell membrane (5) having a second electrode (7') which opposes the first electrode and vibrates during transmission or reception of acoustic energy; a transmitter/receiver coupled to the first and second electrodes which causes the cell membrane to vibrate at an acoustic frequency and/or receives signals at an acoustic frequency; and an acoustic lens (13), overlaying the cell membrane, and having an inner surface opposing the cell membrane and an outer, patient-facing surface. According to the present invention the acoustic lens comprises at least one layer of a material selected from the group of: polybudatiene, polyether block amide (PEBAX), polydimethylsiloxane (PDMS) and buthylrubber.

    REDISTRIBUTION INTERCONNECT FOR MICROBEAMFORMER(S) AND A MEDICAL ULTRASOUND SYSTEM
    8.
    发明授权
    REDISTRIBUTION INTERCONNECT FOR MICROBEAMFORMER(S) AND A MEDICAL ULTRASOUND SYSTEM 有权

    公开(公告)号：EP1838462B1

    公开(公告)日：2018-08-08

    申请号：EP06710648.4

    申请日：2006-01-09

    申请人： Koninklijke Philips N.V.

    发明人： DAVIDSEN, Richard ,  ROBINSON, Andrew, L. ,  SUDOL, Wojtek

    IPC分类号： B06B1/06

    CPC分类号： H01L41/08 ,  B06B1/0622 ,  G01S7/5208 ,  G01S15/8925 ,  Y10T29/49005

    摘要： An ultrasound transducer includes one or more microbeamformer integrated circuit chips, an array of acoustic elements, and a redistribution interconnect coupled via conductive elements between the one or more integrated circuit chips and the array of acoustic elements. The one or more microbeamformer integrated circuit chips each include a plurality of bond pads separated from adjacent ones thereof by a first pitch set. The acoustic elements of the array are separated from adjacent ones thereof by a second pitch set, the second pitch set being different from the first pitch set. In addition, the redistribution interconnect couples on a first side of the redistribution interconnect to the one or more microbeamformer integrated circuit chips via conductive elements. The redistribution interconnect couples on a second side to the array of transducer elements via conductive elements. The redistribution interconnect provides an interconnection between the bond pads of the one or more microbeamformer integrated circuit chips with the first pitch set with corresponding ones of the acoustic elements of the array with the second pitch set.