公开(公告)号：EP3550543A1

公开(公告)日：2019-10-09

申请号：EP18766966.8

申请日：2018-03-08

申请人： Kunshan New Flat Panel Display Technology Center Co., Ltd. ,  Kunshan Go-Visionox Opto-Electronics Co., Ltd.

发明人： DANG, Pengle ,  CHENG, Ji ,  ZHANG, Xiuyu ,  GAO, Meiling

IPC分类号： G09F9/30

摘要： Disclosed are a flexible display screen and a flexible display apparatus. The flexible display screen comprises a display device (21), a flexible substrate (22), a support structure (23) and a drive chip (24). The display device (21) is positioned on the flexible substrate (22), and the flexible substrate (22) is positioned on the support structure (23). A groove (25) is provided in the support structure (23), and the groove (25) is used to receive the drive chip (24). Since the groove (25) for receiving the drive chip (24) is provided in the support structure (23) of the flexible display screen. The drive chip (24) will not cause the screen body of the flexible display screen to bend, thereby not affect the display effect of the flexible display screen.

公开(公告)号：EP3534205A1

公开(公告)日：2019-09-04

申请号：EP17864463.9

申请日：2017-10-30

申请人： Kunshan New Flat Panel Display Technology Center Co., Ltd. ,  Kunshan Go-Visionox Opto-Electronics Co., Ltd.

发明人： ZHANG, Xiuyu ,  XUE, Xiaofei ,  XU, Tao ,  WANG, Xiangqian ,  SUN, Zhan

IPC分类号： G02F1/13 ,  H01L27/32

摘要： A driver circuit carrier, a display panel, a tablet display, and a manufacturing method. The design of a first pin (11) of a driver circuit carrier (1) matches the property of a substrate (10) of the drive circuit carrier (1) to the maximum extent and greatly compensates for tensile deformation of the substrate (10). Due to a second pins (21) in a display panel (2) corresponding to the first pin (11) in the driver circuit carrier (1), the bonding quality of the display panel (2) or the driver circuit carrier (1) after expansion is greatly improved.

公开(公告)号：EP3537479A1

公开(公告)日：2019-09-11

申请号：EP18736181.1

申请日：2018-01-08

申请人： Kunshan New Flat Panel Display Technology Center Co., Ltd. ,  Kunshan Go-Visionox Opto-Electronics Co., Ltd.

发明人： DANG, Pengle ,  CHENG, Ji ,  ZHANG, Xiuyu ,  GAO, Meiling

IPC分类号： H01L27/32 ,  H01L23/12 ,  H01L25/16

摘要： A flexible display (1). A supporting film (12) is pasted to the back of a flexible substrate (11) in the flexible display (1), which improves the rigidity of a flexible display screen (10) to some extent. Particularly, a binding region has no supporting film (12), or the flexibility of the supporting film (12) in the binding region is higher than that of the supporting film (12) in a display region. In this way, the flexible display screen (10) does not warp when a drive chip (20) is bound in a process of manufacturing the flexible display (1), so that the binding is easy because a vacuum cup easily absorbs the flexible display screen (10); in addition, the bonding region is easy to bend, thereby ensuring to satisfy the requirement of the whole flexible display (1) for bend.

公开(公告)号：EP3382759A1

公开(公告)日：2018-10-03

申请号：EP16887726.4

申请日：2016-11-30

申请人： Kunshan New Flat Panel Display Technology Center Co., Ltd.

发明人： ZHANG, Xiuyu ,  WANG, Baoyou ,  DANG, Pengle ,  DING, Liwei ,  ZHANG, Xiaobao ,  ZHU, Hui

IPC分类号： H01L27/12 ,  H01L21/77

CPC分类号： H01L21/77 ,  G02F1/13452 ,  H01L23/3135 ,  H01L27/12

摘要： A bonding structure for a flexible screen and a manufacturing method of the same are provided. A flexible screen and a chip (20) mounted on a surface of the flexible screen are arranged on the bonding structure for the flexible screen, and a bonding area (11) for bonding the chip is arranged on the flexible screen, and a flexible protective layer (30) is coated in the bonding area (11), and the flexible protective layer (30) surrounds around the chip (20). Compared with the prior art, by forming the flexible protective layer (30) with different hardness around the chip (20), the stress generated around the chip (20) during the peeling-off are greatly dispersed, a stress gradient is formed, the stress concentration at the position closely adjacent to the periphery of the chip (20) is avoided, the risk of the circuits around the chip (20) being pulled broken can be reduced, and the peeling-off yield of the flexible screen can be finally increased.