POLYAMIDE COMPOSITION
    1.
    发明公开

    公开(公告)号:EP4455214A1

    公开(公告)日:2024-10-30

    申请号:EP22911158.8

    申请日:2022-12-19

    申请人: Kuraray Co., Ltd.

    摘要: Provided is a polyamide composition, which has high moldability and excellent heat resistance and chemical resistance. The polyamide composition contains a polyamide (A), a copper compound (B 1) and a metal halide (B2), and in which the polyamide (A) comprises a diamine unit (X) and a dicarboxylic acid unit (Y), the diamine unit (X) contains 0.1 mol% or more and less than 36 mol% of a diamine unit (X1), and the diamine unit (X1) is a diamine unit derived from an aliphatic diamine, in which the aliphatic diamine has 6 to 10 carbon atoms, the aliphatic diamine having an alkyl group having 2 or 3 carbon atoms bonded to a carbon atom at 2-position when a carbon atom to which any one of two amino groups is bonded is taken as 1-position.

    POLYAMIDE COMPOSITION
    3.
    发明公开

    公开(公告)号:EP4455218A1

    公开(公告)日:2024-10-30

    申请号:EP22911162.0

    申请日:2022-12-19

    申请人: Kuraray Co., Ltd.

    摘要: A polyamide composition comprising a polyamide (A) and a halogen-free flame-retardant (B), in which the polyamide (A) comprises a diamine unit (X) and a dicarboxylic acid unit (Y), the diamine unit (X) comprises 0.1 mol% or more and less than 36 mol% of a diamine unit (X1), the diamine unit (X1) is a constituent unit derived from an aliphatic diamine, and the aliphatic diamine has 6 to 10 carbon atoms, the aliphatic diamine having an alkyl group having two or three carbon atoms bonded to a carbon atom at 2-position when a carbon atom to which any one of two amino groups is bonded is taken as 1-position.

    COLORED POLYAMIDE RESIN COMPOSITION AND MOLDED BODY THEREOF

    公开(公告)号:EP4134401A1

    公开(公告)日:2023-02-15

    申请号:EP21785010.6

    申请日:2021-04-08

    申请人: Kuraray Co., Ltd.

    摘要: A polyamide resin composition containing, per 100 parts by mass of a particular polyamide (A), 45 to 120 parts by mass of an inorganic filler (B), 25 to 40 parts of at least one kind of a phosphinate salt (C) represented by the particular formula, 2 to 15 parts by mass of a phosphite salt (D), and a colorant (E), having a sulfur element content of less than 220 ppm by mass and ΔE represented by the following expression (1) of more than 1, and a molded body thereof Δ E = L* col − L* nat 2 + a* col − a* nat 2 + b* col − b* nat 2 1 / 2 wherein the symbols in the expression are defined in the description.

    POLYAMIDE COMPOSITION
    7.
    发明公开

    公开(公告)号:EP4455217A1

    公开(公告)日:2024-10-30

    申请号:EP22911161.2

    申请日:2022-12-19

    申请人: Kuraray Co., Ltd.

    IPC分类号: C08L77/06 C08G69/02 C08L25/18

    摘要: A polyamide composition, which comprises a polyamide (A) and comprises a halogenated flame retardant (B), and in which the polyamide (A) comprises a diamine unit (X) and a dicarboxylic acid unit (Y), the diamine unit (X) comprises 0.1 mol% or more and less than 36 mol% of a diamine unit (X1), and the diamine unit (X1) is a constituent unit derived from an aliphatic diamine, and the aliphatic diamine has 6 to 10 carbon atoms, the aliphatic diamine having an alkyl group having two or three carbon atoms bonded to a carbon atom at 2-position when a carbon atom to which any one of two amino groups is bonded is taken as 1-position.

    POLYAMIDE COMPOSITION
    8.
    发明公开

    公开(公告)号:EP4455215A1

    公开(公告)日:2024-10-30

    申请号:EP22911159.6

    申请日:2022-12-19

    申请人: Kuraray Co., Ltd.

    IPC分类号: C08L77/06 C08G69/02 C08K5/13

    摘要: Provided is a polyamide composition, which has high moldability and excellent heat resistance and chemical resistance. The polyamide composition contains a polyamide (A) and an organic heat stabilizer (B), and in which the polyamide (A) contains a diamine unit (X) and a dicarboxylic acid unit (Y), the diamine unit (X) contains 0.1 mol% or more and less than 36 mol% of a diamine unit (X1), and the diamine unit (X1) is a constituent unit derived from an aliphatic diamine, in which the aliphatic diamine has 6 to 10 carbon atoms, the aliphatic diamine having an alkyl group having 2 or 3 carbon atoms bonded to a carbon atom at 2-position when a carbon atom to which any one of two amino groups is bonded is taken as 1-position.

    POLYAMIDE RESIN COMPOSITION AND MOLDED OBJECT THEREOF

    公开(公告)号:EP4067427A1

    公开(公告)日:2022-10-05

    申请号:EP20893574.2

    申请日:2020-11-25

    申请人: Kuraray Co., Ltd.

    IPC分类号: C08K5/51 C08K7/14 C08L77/06

    摘要: Provided are a polyamide resin composition containing 100 parts by mass of a specific polyamide (A), 45 to 120 parts by mass of an inorganic fibrous reinforcing material (B), 25 to 40 parts by mass of at least one phosphinate salt (C) represented by a specific formula, and 2 to 15 parts by mass of a phosphite salt (D), the phosphinate salt (C) and the phosphite salt (D) being contained at a specific ratio, and a molded object of the polyamide resin composition.