公开(公告)号：EP4224518A1

公开(公告)日：2023-08-09

申请号：EP21875158.4

申请日：2021-09-13

申请人： Kyocera Corporation

发明人： MAEDA, Akihiro ,  NAKAMOTO, Shinji

IPC分类号： H01L23/02 ,  H01L23/12 ,  H01P5/02 ,  H01P3/00

摘要： A wiring substrate includes a substrate, a signal conductor, and a ground conductor. The substrate has a first surface and an opening provided in a first surface and being a mounting region for an electronic component. The signal conductor is located on the first surface and extends in a first direction from the opening toward an outer edge of the substrate. The ground conductor is located on the first surface and extends in the first direction, with the signal conductor being sandwiched between portions of the ground conductor. The signal conductor includes a first section, a second section, and a third section arranged in sequence in the first direction. When a dimension of each section in a second direction orthogonal to the first direction in a plan view of the first surface is defined as width, the first section and the third section are each wider than the second section. The ground conductor includes a protrusion extending toward the first section.