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    THERMOELECTRIC MODULE
    1.
    发明公开
    THERMOELECTRIC MODULE 审中-公开

    公开(公告)号：EP3553838A1

    公开(公告)日：2019-10-16

    申请号：EP17902881.6

    申请日：2017-12-26

    申请人： LG Chem, Ltd.

    发明人： KIM, Su Jin ,  LEE, II Ha ,  PARK, Pum Suk ,  OH, Hyungju ,  KIM, Dong Sik ,  LIM, Byung Kyu ,  KIM, Ki Hwan ,  PARK, Cheol Hee

    IPC分类号： H01L35/14 ,  H01L35/16 ,  H01L35/18 ,  H01L35/08 ,  H01L35/34

    摘要： The present invention provides a thermoelectric module comprising: plural thermoelectric elements comprising thermoelectric semiconductor; an electrode for connecting between the plural thermoelectric elements; and a joining layer for joining the thermoelectric element and electrode, positioned between each thermoelectric element and electrode, wherein the thermoelectric module further comprises a barrier layer comprising Cu-Mo-Ti alloy, positioned between the thermoelectric element and joining layer, thereby preventing heat diffusion of the material of a joining layer, preventing the oxidation and deformation of the thermoelectric element under high temperature environment, and exhibiting improved operational stability due to excellent adhesion to a thermoelectric element.