公开(公告)号：EP3696556A3

公开(公告)日：2020-09-09

申请号：EP20157409.2

申请日：2020-02-14

申请人： LG Electronics Inc.

发明人： LEE, Jonggyu ,  KIM, Sangyub ,  LEE, Joonhwan ,  AHN, Junho

IPC分类号： G01R15/20

摘要： A printed circuit board assembly is disclosed. The printed circuit board assembly includes a printed circuit board, a sensor mounted on a first side of the printed circuit board, the sensor being configured to detect a magnetic field, and a bus bar disposed in contact with a second side of the printed circuit board, wherein a thickness between a region of the second side of the printed circuit board in contact with the bus bar, and the first side of the printed circuit board is smaller than a thickness between a remaining region of the second side of the printed circuit board and the first side of the printed circuit board, the remaining region excluding the region of the second side of the printed circuit board in contact with the bus bar.

公开(公告)号：EP3696556A2

公开(公告)日：2020-08-19

申请号：EP20157409.2

申请日：2020-02-14

申请人： LG Electronics Inc.

发明人： LEE, Jonggyu ,  KIM, Sangyub ,  LEE, Joonhwan ,  AHN, Junho

IPC分类号： G01R15/20

摘要： A printed circuit board assembly is disclosed. The printed circuit board assembly includes a printed circuit board, a sensor mounted on a first side of the printed circuit board, the sensor being configured to detect a magnetic field, and a bus bar disposed in contact with a second side of the printed circuit board, wherein a thickness between a region of the second side of the printed circuit board in contact with the bus bar, and the first side of the printed circuit board is smaller than a thickness between a remaining region of the second side of the printed circuit board and the first side of the printed circuit board, the remaining region excluding the region of the second side of the printed circuit board in contact with the bus bar.