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公开(公告)号：EP3780125A1
公开(公告)日：2021-02-17
申请号：EP19782246.3
申请日：2019-04-04
申请人： LG Innotek Co., Ltd.
摘要： A heat converter according to one embodiment of the present invention comprises: a plurality of unit modules respectively arranged in a first direction and a second direction that intersects the first direction; and a frame, which supports the plurality of unit modules, allows cooling water to flow in through one surface arranged in the first direction, and allows the cooling water to be discharged through the other surface arranged in the first direction, wherein each unit module includes: a cooling water passage chamber having first and second surfaces arranged to be spaced in the first direction, third and fourth surfaces arranged to be spaced in a third direction that intersects the first direction and the second direction, a fifth surface arranged to be spaced in the second direction such that cooing water flows therein, and a sixth surface from which cooling water is discharged; a first thermoelectric module arranged on the first surface; and a second thermoelectric module arranged on the second surface, the first thermoelectric module includes a plurality of group thermoelectric elements, each group thermoelectric element includes a plurality of thermoelectric elements, which have the same minimum spacing distance from the fourth surface in the third direction, and the plurality of thermoelectric elements in at least one group thermoelectric element of the plurality of group thermoelectric elements are electrically connected to each other.
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公开(公告)号：EP3933947A1
公开(公告)日：2022-01-05
申请号：EP21192196.0
申请日：2020-02-11
申请人： LG Innotek Co., Ltd.
发明人： JEON, Seong Jae , KIM, Sung Chul
摘要： A thermoelectric module according to an exemplary embodiment includes one first metal substrate including a first through-hole and a second through-hole;an upper substrate part disposed on the one first metal substrate, including a second metal substrate including a third through-hole and a third metal substrate including a fourth through-hole; a first insulating layer and a plurality of second insulating layers disposed between the one first metal substrate and the upper substrate part; a first electrode part and a second electrode part disposed between the first insulating layer and the plurality of insulating layers; a plurality of thermoelectric legs disposed between the first electrode part and the second electrode part; a first coupling member; and a second coupling member, wherein the first insulating layer is in direct contact with the one first metal substrate, wherein each of the plurality of second insulating layers is in direct contact with the second metal substrate and the third metal substrate, wherein the one first metal substrate includes a first effective region in which the first electrode part is disposed and a first peripheral region formed outside the first effective region, wherein the second metal substrate includes a second effective region in which the second electrode part is disposed and a second peripheral region formed outside the second effective region, wherein the third metal substrate includes a third effective region in which the second electrode part is disposed and a third peripheral region formed outside the third effective region, wherein the first through-hole and the second through-hole are disposed in the first effective region, wherein the third through-hole is disposed in the second effective region, wherein the fourth through-hole is disposed in the third effective region, wherein the first through-hole and the third through-hole are disposed at positions corresponding to each other, wherein the second through-hole and the fourth through-hole are disposed at positions corresponding to each other, wherein the first coupling member is disposed on the first through-hole and the third through-hole, and wherein the second coupling member is disposed on the second through-hole and the fourth through-hole.
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公开(公告)号：EP3696868A1
公开(公告)日：2020-08-19
申请号：EP20156742.7
申请日：2020-02-11
申请人： LG Innotek Co., Ltd.
发明人： JEON, Seong Jae , KIM, Sung Chul
摘要： A thermoelectric module according to an exemplary embodiment includes a first metal substrate including a first through-hole, a first insulating layer disposed on the first metal substrate, a first electrode part disposed on the first insulating layer and including a plurality of first electrodes, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the first electrode part, a second electrode part disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs and including a plurality of second electrodes, a second insulating layer disposed on the second electrode part, and a second metal substrate disposed on the second insulating layer and including a second through-hole, wherein the first metal substrate includes an effective region in which the first electrode part is disposed and a peripheral region formed outside the effective region, the second metal substrate includes an effective region in which the second electrode part is disposed and a peripheral region formed outside the effective region, the first through-hole is disposed in the effective region of the first metal substrate, the second through-hole is disposed in the effective region of the second metal substrate, and the first through-hole and the second through-hole are formed at positions corresponding to each other.
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公开(公告)号：EP3637485A1
公开(公告)日：2020-04-15
申请号：EP18812615.5
申请日：2018-06-07
申请人： LG Innotek Co., Ltd.
发明人： LEE, Un Hak , BONG, Sang Hoon , SONG, Young Kil , SONG, Yun Sang , KIM, Jung Ho , JEON, Seong Jae , YOO, Young Sam , KIM, Sung Chul
摘要： A heat conversion apparatus according to one embodiment of the present invention comprises: a pipe which includes a first flat surface and a second flat surface disposed parallel to the first surface, and through which air having a lower temperature than entered air is discharged; a plurality of thermoelectric elements that have heat-absorbing surfaces disposed in external sides of the respective first and second surfaces; a plurality of printed circuit boards (PCBs) that are electrically connected to the plurality of thermoelectric elements; and coolant passing members that are disposed on heat-radiating surfaces of the plurality of thermoelectric elements, wherein an external floor surface of the coolant passing member includes a plurality of first external floor surfaces having a first height and a plurality of second external floor surfaces having a second height that is different from the first height, the plurality of first external floor surfaces are in contact with the heat-radiating surfaces of the plurality of thermoelectric elements, and the plurality of PCBs are disposed in the plurality of second external floor surfaces.
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