公开(公告)号：EP3234981A4

公开(公告)日：2018-07-11

申请号：EP15870686

申请日：2015-12-04

申请人： LOCKHEED CORP

发明人： BISHOP JAMES E ,  JOHNSON ALLAN ,  KAPLUN BRIAN ,  MCELWAIN STEVEN E JR ,  VOS DAVID L

IPC分类号： H01J40/14 ,  H01J5/02

CPC分类号： G01D11/245 ,  G02B6/04 ,  G02B6/4298

摘要： A gigahertz sensor array packaging solution for harsh operating environments is disclosed. The sensor array packaging system includes a structural core body comprising sensor mounting features on a surface thereof and an alignment through hole extending from the surface to a backside thereof which incorporates finned features providing cooling and stiffness. The sensor array packaging system further includes one or more electro-optical components mounted to the backside of the structural core body. The sensor array packaging system further includes a wiring board comprising a plurality of sensor array elements contacting walls of the spiral ribbon configuration, each having a cable extending through the through hole to at least one of the one or more electro-optical components.

公开(公告)号：EP3030486A4

公开(公告)日：2017-04-12

申请号：EP14835349

申请日：2014-08-06

申请人： LOCKHEED CORP

发明人： MALIA MIKE ,  KAPLUN BRIAN ,  CONSALVIA DOMINICK

IPC分类号： B64C9/00 ,  A63H27/00 ,  B29C65/02 ,  B29C65/48 ,  B29C65/50 ,  B29C65/70 ,  B29C70/34 ,  B29K21/00 ,  B29K101/12 ,  B29K105/08 ,  B29L9/00 ,  B29L31/22 ,  B65G17/00 ,  E05D1/00

CPC分类号： E05D1/00 ,  A63H27/02 ,  B29C45/14336 ,  B29C45/14508 ,  B29C45/14786 ,  B29C45/1671 ,  B29C65/02 ,  B29C65/4835 ,  B29C65/5021 ,  B29C65/5028 ,  B29C65/5042 ,  B29C65/70 ,  B29C66/1122 ,  B29C66/1222 ,  B29C66/1226 ,  B29C66/12441 ,  B29C66/43 ,  B29C66/71 ,  B29C66/721 ,  B29C66/723 ,  B29C66/7292 ,  B29C66/73751 ,  B29C66/73753 ,  B29C70/345 ,  B29K2021/003 ,  B29K2101/12 ,  B29K2105/089 ,  B29L2009/00 ,  B29L2031/22 ,  B64C9/02 ,  E05Y2800/45 ,  E05Y2800/68 ,  Y10T16/525 ,  B29K2077/00 ,  B29K2067/00 ,  B29K2063/00 ,  B29K2033/12 ,  B29K2033/08 ,  B29K2021/00