摘要:
This invention relates to electrolytes for plating tin, lead and particularly tin-lead alloys comprising a lead and/or tin alkyl or alkylol sulfonate, an alkyl or alkylol sulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound, and methods for the preparation thereof.