Method for preparing an electrolyte solution for electroplating tin or tin-lead alloys
    2.
    发明公开
    Method for preparing an electrolyte solution for electroplating tin or tin-lead alloys 失效
    一种生产用于电镀锡或锡 - 铅合金的电解质溶液的方法。

    公开(公告)号:EP0216955A1

    公开(公告)日:1987-04-08

    申请号:EP85115693.5

    申请日:1985-12-10

    申请人: LeaRonal, Inc.

    IPC分类号: C25D3/60 C25D3/32 C25D3/36

    摘要: This invention relates to electrolytes for plating tin, lead and particularly tin-lead alloys comprising a lead and/or tin alkyl or alkylol sulfonate, an alkyl or alkylol sulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound, and methods for the preparation thereof.

    摘要翻译: 本发明涉及电解质用于电镀锡,铅和特别是锡 - 铅合金,包括铅和/或锡的烷基或羟烷基磺酸盐,约烷基或以足够的量烷醇磺酸以赋予pH低于3的浴,并 各种添加剂以改进沉积物的含季氮的润湿剂含有脂肪酸基团,亚烷基氧化物,吡啶类化合物,芳族醛,乙醛和/亮度,有用的电流密度范围,和/或锡 - 铅合金沉积物的可焊性 或铋化合物,以及其制备方法。