公开(公告)号：EP3403303A1

公开(公告)日：2018-11-21

申请号：EP17753975.6

申请日：2017-02-17

申请人： MACOM Technology Solutions Holdings, Inc.

发明人： HEMENWAY, Roe ,  STAGARESCU, Cristian ,  MEEROVICH, Daniel ,  GREEN, Malcolm, R. ,  PARZ, Wolfgang ,  MA, Jichi ,  GRZYBOWSKI, Richard Robert ,  BICKEL, Nathan

IPC分类号： H01S5/022 ,  H01S5/02 ,  H01S5/026

摘要： Techniques for efficient alignment of a semiconductor laser in a Photonic Integrated Circuit (PIC) are disclosed. In some embodiments, a photonic integrated circuit (PIC) may include a semiconductor laser that includes a laser mating surface, and a substrate that includes a substrate mating surface. A shape of the laser mating surface and a shape of the substrate mating surface may be configured to align the semiconductor laser with the substrate in three dimensions.

公开(公告)号：EP3691060A1

公开(公告)日：2020-08-05

申请号：EP20163531.5

申请日：2017-02-17

申请人： MACOM Technology Solutions Holdings, Inc.

发明人： HEMENWAY, Roe ,  STAGARESCU, Cristian ,  MEEROVICH, Daniel ,  GREEN, Malcolm, R. ,  PARZ, Wolfgang ,  MA, Jichi ,  GRZYBOWSKI, Richard Robert ,  BICKEL, Nathan

IPC分类号： H01S5/022 ,  G02B6/42 ,  H01S5/00 ,  H01S5/10 ,  H01S5/32

摘要： Techniques for efficient alignment of a semiconductor laser in a Photonic Integrated Circuit (PIC) are disclosed. In some embodiments, a photonic integrated circuit (PIC) may include a semiconductor laser that includes a laser mating surface, and a substrate that includes a substrate mating surface. A shape of the laser mating surface and a shape of the substrate mating surface may be configured to align the semiconductor laser with the substrate in three dimensions.

公开(公告)号：EP3403303B1

公开(公告)日：2020-04-22

申请号：EP17753975.6

申请日：2017-02-17

申请人： MACOM Technology Solutions Holdings, Inc.

发明人： HEMENWAY, Roe ,  STAGARESCU, Cristian ,  MEEROVICH, Daniel ,  GREEN, Malcolm, R. ,  PARZ, Wolfgang ,  MA, Jichi ,  GRZYBOWSKI, Richard Robert ,  BICKEL, Nathan

IPC分类号： H01S5/022 ,  G02B6/42 ,  H01S5/00 ,  H01S5/10 ,  H01S5/32

公开(公告)号：EP3447556A3

公开(公告)日：2019-03-27

申请号：EP18194958.7

申请日：2017-02-17

申请人： MACOM Technology Solutions Holdings, Inc.

发明人： HEMENWAY, Roe ,  STAGARESCU, Cristian ,  MEEROVICH, Daniel ,  GREEN, Malcolm, R. ,  PARZ, Wolfgang ,  MA, Jichi ,  GRZYBOWSKI, Richard Robert ,  BICKEL, Nathan

IPC分类号： G02B6/42 ,  H01S5/022 ,  H01S5/00 ,  H01S5/10 ,  H01S5/32

摘要： Techniques for efficient alignment of a semiconductor laser in a Photonic Integrated Circuit (PIC) are disclosed. In some embodiments, a photonic integrated circuit (PIC) may include a semiconductor laser that includes a laser mating surface, and a substrate that includes a substrate mating surface. A shape of the laser mating surface and a shape of the substrate mating surface may be configured to align the semiconductor laser with the substrate in three dimensions.