METHOD AND DEVICE FOR ELECTROMAGNETIC FIELD ANALYSIS OF CIRCUIT BOARD, AND CIRCUIT BOARD AND ITS DESIGN METHOD
    2.
    发明公开
    METHOD AND DEVICE FOR ELECTROMAGNETIC FIELD ANALYSIS OF CIRCUIT BOARD, AND CIRCUIT BOARD AND ITS DESIGN METHOD 审中-公开
    方法和设备分析电磁场的电路板,线路板及其设计方法

    公开(公告)号:EP1615151A4

    公开(公告)日:2006-08-02

    申请号:EP04771269

    申请日:2004-08-05

    摘要: An electromagnetic field analyzing method includes a step (S1) of initializing a conductor pattern form in each layer of a multilayer circuit board, a step (S2) of initializing a port for signal input/output from/to outside in the conductor pattern, a step (S3) of two-dimensionally dividing the multilayer circuit board into a plurality of areas, steps (S4a, S4b) of setting an additional port on the edge of the new conductor pattern formed by the area division, steps (S5a, S5b) of setting individual analysis conditions for the initial port and the additional port, steps (S6a, S6b) of conducting the electromagnetic field analysis for every divided area on the multilayer circuit board based on the corresponding analysis conditions, and a step (S8) of combining the results of electromagnetic analysis on the divided areas and obtaining the electromagnetic analysis result on the entire board. In this way, an electromagnetic analysis on a multilayer circuit board can be conducted in a short time, greatly reducing the time and cost needed for circuit board design.

    MULTILAYER ELECTRONIC PART, MULTILAYER ANTENNA DUPLEXER, AND COMMUNICATION APPARATUS
    3.
    发明公开
    MULTILAYER ELECTRONIC PART, MULTILAYER ANTENNA DUPLEXER, AND COMMUNICATION APPARATUS 审中-公开
    多层电子元件,更多层的天线双工和通信设备

    公开(公告)号:EP1267438A4

    公开(公告)日:2004-03-31

    申请号:EP01912345

    申请日:2001-03-14

    IPC分类号: H01P1/203

    CPC分类号: H01P1/20345 H01P1/2039

    摘要: A multilayer filter comprising a first dielectric layer (2101a) having a first shield electrode provided on one major surface, a second dielectric layer (b) having a resonator electrode provided on the one major surface, a third dielectric layer (2101c) having a bond electrode provided oppositely to a part of the resonator electrode on the one major surface, a fourth dielectric layer (2101d) having a second shield electrode provided on the one major surface, a fifth dielectric layer (2101e) where at least the one major surface is exposed to the outside, and a ground electrode (2108) provided on the other major surface of the first dielectric layer and/or the one major surface of the fifth dielectric layer, characterized in that the first ground electrode and the first shield electrode are connected electrically through a via hole (2109) made in the first dielectric layer.