摘要:
The present invention provides a small and low loss laminated bandpass filter by placing two strip lines 313 and 314 that form a resonator in a certain distance on the same layer and thereby electromagnetically coupling these strip lines.
摘要:
An electromagnetic field analyzing method includes a step (S1) of initializing a conductor pattern form in each layer of a multilayer circuit board, a step (S2) of initializing a port for signal input/output from/to outside in the conductor pattern, a step (S3) of two-dimensionally dividing the multilayer circuit board into a plurality of areas, steps (S4a, S4b) of setting an additional port on the edge of the new conductor pattern formed by the area division, steps (S5a, S5b) of setting individual analysis conditions for the initial port and the additional port, steps (S6a, S6b) of conducting the electromagnetic field analysis for every divided area on the multilayer circuit board based on the corresponding analysis conditions, and a step (S8) of combining the results of electromagnetic analysis on the divided areas and obtaining the electromagnetic analysis result on the entire board. In this way, an electromagnetic analysis on a multilayer circuit board can be conducted in a short time, greatly reducing the time and cost needed for circuit board design.
摘要:
A multilayer filter comprising a first dielectric layer (2101a) having a first shield electrode provided on one major surface, a second dielectric layer (b) having a resonator electrode provided on the one major surface, a third dielectric layer (2101c) having a bond electrode provided oppositely to a part of the resonator electrode on the one major surface, a fourth dielectric layer (2101d) having a second shield electrode provided on the one major surface, a fifth dielectric layer (2101e) where at least the one major surface is exposed to the outside, and a ground electrode (2108) provided on the other major surface of the first dielectric layer and/or the one major surface of the fifth dielectric layer, characterized in that the first ground electrode and the first shield electrode are connected electrically through a via hole (2109) made in the first dielectric layer.