公开(公告)号：EP0977471A4

公开(公告)日：2001-10-10

申请号：EP98957171

申请日：1998-12-04

申请人： MATSUSHITA ELECTRONICS CORP

发明人： YAMANE SHIGERU ,  NISHII TOSHIHIRO ,  NAKAMURA SHINJI ,  SAKAI MASAYUKI

IPC分类号： B23K26/00 ,  B23K26/12 ,  B23K26/38 ,  H05K3/00 ,  H05K3/22 ,  H05K3/40

CPC分类号： H05K3/0032 ,  H05K3/227 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2203/081 ,  H05K2203/085 ,  H05K2203/1383 ,  H05K2203/1388 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T156/1056 ,  Y10T156/1062 ,  Y10T428/24994 ,  Y10T442/2902

摘要： A method of fabricating a circuit-forming-substrate comprising the step of forming a hole by an energy beam such as a laser beam, wherein formation of a resin film by a substrate-material resin oozing to the inner-wall surface of a hole is prevented, by lowering the water-absorption percentage of a substrate material through the dehumidifying step as the preprocess of the hole-forming step for forming a through-hole or non-through-hole for interconnecting circuits formed on both sides or in multiple layers, thereby it is possible to realize high-quality hole-formation by preventing a defective resin film formation and obtain a high-reliability circuit forming substrate.

摘要翻译： 一种用于制造印刷布线板，其包括通过在能量束而形成孔的步骤的方法：薄膜由基底材料树脂渗出到孔的内壁表面上，如激光束，worin形成树脂的防止 ，通过除湿步骤作为用于形成用于互连上形成bothsides或在多个层中的电路的贯通孔或非贯通孔的孔加工工序的预处理降低一个基底材料的吸水百分率，从而 它可以通过防止有缺陷的树脂膜形成，实现高品质的孔加工的形成和得到高可靠性的印刷布线板。