公开(公告)号：EP1489652A3

公开(公告)日：2009-02-18

申请号：EP04021136.9

申请日：1996-09-19

申请人： MINNESOTA MINING AND MANUFACTURING COMPANY

发明人： Bruxvoort, Wesley J. ,  Culler, Scott R. ,  Ho, Kwok-Lun ,  Kaisaki, David A. ,  Kessel, David A. ,  Klun, Thomas P. ,  Kranz, Heather K. ,  Messner, Robert P. ,  Webb, Richard J. ,  Williams, Julia P.

IPC分类号： H01L21/3105 ,  H01L21/321 ,  B24D3/16 ,  B24B21/04 ,  B24B37/04 ,  B24B53/007 ,  B24D3/28 ,  B24D11/00

CPC分类号： B24B53/017 ,  B24B21/04 ,  B24B37/042 ,  B24D3/28 ,  B24D11/00 ,  H01L21/31053

摘要： A method of modifying a surface of a semiconductor wafer comprising the steps of:
contacting said surface with a three-dimensional, textured, fixed abrasive article comprising a plurality of abrasive composites arranged in the form of a pre-determined pattern, said composites comprising a plurality of abrasive particles dispersed in a binder; and
relatively moving said wafer and said fixed abrasive article in the presence of a liquid medium to modify said surface of said wafer.