公开(公告)号：EP1315230A4

公开(公告)日：2004-06-23

申请号：EP00956812

申请日：2000-08-30

申请人： MITSUBISHI ELECTRIC CORP

发明人： TAJIMA KENICHI ,  TSURU MASAOMI ,  UESUGI MIKIO ,  ITOH KENJI ,  ISOTA YOJI

IPC分类号： H01L27/08 ,  H01P3/06 ,  H01P3/08 ,  H01L27/04

CPC分类号： H01P3/081 ,  H01L27/08 ,  H01P3/06

摘要： A high-frequency circuit for carrying high-frequency signals in microwave and millimeter bands comprises a semiconductor substrate (21), a grounding conductor (22) provided under the semiconductor substrate (21), an insulator (23) provided on the semiconductor substrate (21) and having higher effective dielectric constant than the semiconductor substrate (21), and a strip conductor (25) provided on a recessed part (24) in the middle area of the insulator (23).