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1.发明公开COPPER ALLOY FOR ELECTRONIC/ELECTRICAL EQUIPMENT, COPPER ALLOY THIN SHEET FOR ELECTRONIC/ELECTRICAL EQUIPMENT, CONDUCTIVE COMPONENT FOR ELECTRONIC/ELECTRICAL EQUIPMENT, AND TERMINAL 审中-公开铜合金于电子/电气设备，铜合金薄膜于电子/电气设备，传导组件于电子/电气设备及终端
公开(公告)号：EP3020837A4
公开(公告)日：2017-02-15
申请号：EP14822807
申请日：2014-02-20
发明人： MAKI KAZUNARI , MORI HIROYUKI , YAMASHITA DAIKI
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公开(公告)号：EP2977475A4
公开(公告)日：2016-12-28
申请号：EP13878640
申请日：2013-08-29
发明人： MAKI KAZUNARI , MORI HIROYUKI , YAMASHITA DAIKI
CPC分类号： H01B1/026 , C22C9/04 , C22F1/00 , C22F1/08 , H01L23/49579 , H01L2924/0002 , H01L2924/0001 , H01L2924/00
摘要： A copper alloy for an electric and electronic device, which has a reliably and sufficiently excellent stress relaxation resistance; and excellent bendability, is provided. In addition, a copper alloy sheet and a terminal using the copper alloy are provided. The copper alloy includes: Zn at higher than 2 mass% and lower than 23 mass%; Sn at 0.1 mass% or more and 0.9 mass% or less; Ni at 0.05 mass% or more and lower than 1.0 mass%; Fe at 0.001 mass% or more and lower than 0.10 mass%; P at 0.005 mass% or more and 0.1 mass% or less;; and a balance including Cu and unavoidable impurities, wherein a ratio Fe/Ni of a Fe content to a Ni content satisfies 0.002‰¤Fe/Ni
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3.发明公开
公开(公告)号：EP2977476A4
公开(公告)日：2016-12-28
申请号：EP13878726
申请日：2013-08-29
发明人： MAKI KAZUNARI , MORI HIROYUKI , YAMASHITA DAIKI
CPC分类号： H01B1/026 , C22C9/04 , C22F1/00 , C22F1/08 , H01L23/49579 , H01L2924/0002 , H01L2924/0001 , H01L2924/00
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4.发明公开
公开(公告)号：EP2940166A4
公开(公告)日：2016-09-21
申请号：EP13867578
申请日：2013-12-26
发明人： MAKI KAZUNARI , MORI HIROYUKI , YAMASHITA DAIKI
CPC分类号： H01B1/026 , B32B15/01 , B32B15/04 , B32B15/043 , B32B15/20 , C22C9/00 , C22C9/04 , C22C9/06 , C22F1/08 , C23C2/08 , C23C30/00 , C23C30/005 , H01B5/02 , Y10T428/12 , Y10T428/12431 , Y10T428/12438 , Y10T428/12715 , Y10T428/12882 , Y10T428/12903 , Y10T428/1291 , Y10T428/12917 , Y10T428/12924
摘要： The present invention relates to a copper alloy for electric and electronic device, a copper alloy sheet for electric and electronic device, a conductive component for electric and electronic device, and a terminal. The copper alloy for electric and electronic device includes more than 2.0 mass% to 15.0 mass% of Zn; 0.10 mass% to 0.90 mass% of Sn; 0.05 mass% to less than 1.00 mass% of Ni; 0.001 mass% to less than 0.100 mass% of Fe; 0.005 mass% to 0.100 mass% of P; and a remainder comprising Cu and unavoidable impurities, in which 0.002‰¤Fe/Ni
摘要翻译： 本发明涉及一种用于电气和电子设备，铜合金板，电气和电子设备，电气和电子设备中的导电部件，和一个终端铜合金。 锌用于电气和电子设备包括：超过2.0质量％〜15.0质量％的铜合金; 12:10质量％至Sn 0.90质量％; 12时05质量％的Ni小于1点00质量％; 0.001质量％至的Fe质量小于0.100％; 0.005质量％〜P的0.100质量％; 和哪个‰¤Fe/镍1.500，3.0 <（镍+ Fe）的/ P <100.0，和0点十<的Sn /（镍+ Fe）的<5点00用原子比满足<在0002剩余部分的Cu和不可避免的杂质，其包括， 和屈服比YS / TS是90％以上的所有其由强度TS和0.2％屈服强度YS当拉伸试验在平行的方向上进行轧制方向计算。
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5.发明公开
公开(公告)号：EP2940165A4
公开(公告)日：2016-09-21
申请号：EP13867316
申请日：2013-12-25
发明人： MAKI KAZUNARI , MORI HIROYUKI , YAMASHITA DAIKI
CPC分类号： C22C9/04 , B32B15/01 , C22F1/002 , C22F1/02 , C22F1/08 , H01B1/026 , Y10T428/12 , Y10T428/12715
摘要： The present invention relates to a copper alloy for electric and electronic device, a copper alloy sheet for electric and electronic device, a conductive component for electric and electronic device, and a terminal. The copper alloy for electric and electronic device comprises more than 2.0 mass% and less than 23.0 mass% of Zn; 0.10 mass% to 0.90 mass% of Sn; 0.05 mass% to less than 1.00 mass% of Ni; 0.001 mass% to less than 0.100 mass% of Fe; 0.005 mass% to 0.100 mass% of P; and a balance including Cu and unavoidable impurities, in which 0.002‰¤Fe/Ni
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6.发明公开COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, COPPER ALLOY THIN PLATE FOR ELECTRONIC/ELECTRIC DEVICE, ELECTROCONDUCTIVE COMPONENT AND TERMINAL FOR ELECTRONIC/ELECTRIC DEVICE 审中-公开铜合金于电子/电气设备，薄铜合金板于电子/机电设备，组织的电子元件和终端电子/电气设备
公开(公告)号：EP2949769A4
公开(公告)日：2016-12-28
申请号：EP13872724
申请日：2013-06-28
发明人： MAKI KAZUNARI , MORI HIROYUKI , YAMASHITA DAIKI
CPC分类号： H01B1/026 , B21B3/00 , B32B15/01 , C22C9/04 , C22F1/00 , C22F1/08 , H01B5/02 , Y10T428/12 , Y10T428/12715
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7.发明公开
公开(公告)号：EP2940167A4
公开(公告)日：2016-09-21
申请号：EP13869646
申请日：2013-06-28
发明人： MAKI KAZUNARI , MORI HIROYUKI , YAMASHITA DAIKI
摘要： A copper alloy for an electric and electronic device comprises more than 2 mass% and less than 23 mass% of Zn; 0.1 mass% to 0.9 mass% of Sn; 0.05 mass% to less than 1.0 mass% of Ni; 0.001 mass% to less than 0.10 mass% of Fe; 0.005 mass% to 0.1 mass% of P; and a balance including Cu and unavoidable impurities, in which 0.002‰¤Fe/Ni
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